HEAT TREATMENT DEVICE

WIPO Patent Application WO/2018/181651

A1

A heat treatment device (1) using heat exchange between a first fluid (M) and a second fluid (HC) is provided with: a first heat transfer body (7) having a first flow channel (17) for circulating the first fluid (M, P); a second heat transfer body (9), which has a second flow channel (31) for circulating the second fluid (HC), and which is laminated on the first heat transfer body (7); and housings (53, 57), which are in contact with surfaces including end portions of a bonding surface between the first heat transfer body (7) and the second heat transfer body (9), and which respectively have spaces (S2, S3) that are in communication with the second flow channel (31). The first heat transfer body (7) also has third flow channels (18, 24), which are respectively formed in wall sections (19, 13) that separate the first flow channel (17) and the spaces (S2, S3) of the housings (53, 57) from each other. The first flow channel (17) is a groove in contact with the bonding surface, and the third flow channels (18, 24) are grooves in contact with the bonding surface, said third flow channels respectively intersecting virtual straight lines (L1, L2) that connect the first flow channel (17) and the spaces (S2, S3) of the housings (53, 57) to each other on the bonding surface.

YANO AKIHISA (JP)
OKA TATSUYA (JP)
AKITA TAKAHITO (JP)
YAMAMOTO TAIGA (JP)
SHIBUYA HIDESHI (JP)
TAKEUCHI YUSUKE (JP)
KAMATA HIROYUKI (JP)

PCT/JP2018/013096

October 04, 2018

March 29, 2018

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IHI CORP (JP)

B01J19/00; F28D9/02; F28F3/00; F28F27/00; C01B3/36

WO2013069706A1	2013-05-16
WO2016199790A1	2016-12-15

JP2013119382A	2013-06-17
JPS55122083U	1980-08-29
JP2009536143A	2009-10-08

See also references of EP 3603793A4

MIYOSHI Hidekazu et al. (JP)

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