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Title:
HEAT-TREATMENT FURNACE
Document Type and Number:
WIPO Patent Application WO/2011/152510
Kind Code:
A1
Abstract:
The disclosed heat-treatment furnace, used in a semiconductor-substrate heat-treatment step, is characterized by the provision of a cylindrical core, both ends of which have openings sized so as to allow insertion and removal of semiconductor substrates. This reduces standby time between batches during consecutive semiconductor heat treatment, thereby improving productivity. Furthermore, the use of a simple cylindrical shape for the structure of the core reduces the frequency at which gas-introduction pipe sections fail, thereby decreasing the running cost of the heat-treatment process.

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Inventors:
MURAKAMI TAKASHI (JP)
WATABE TAKENORI (JP)
OTSUKA HIROYUKI (JP)
Application Number:
PCT/JP2011/062753
Publication Date:
December 08, 2011
Filing Date:
June 03, 2011
Export Citation:
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Assignee:
SHINETSU CHEMICAL CO (JP)
MURAKAMI TAKASHI (JP)
WATABE TAKENORI (JP)
OTSUKA HIROYUKI (JP)
International Classes:
H01L21/22
Foreign References:
JPH04364028A1992-12-16
JPS58154227A1983-09-13
JPS6430234A1989-02-01
JPS63213925A1988-09-06
JPS54156470A1979-12-10
JPH05102054A1993-04-23
Other References:
See also references of EP 2579298A4
Attorney, Agent or Firm:
KOJIMA TAKASHI (JP)
Takashi Kojima (JP)
Download PDF:
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Claims:



 
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