Title:
HEAT TREATMENT METHOD AND HEAT TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/105449
Kind Code:
A1
Abstract:
When a command is issued for the commencement of dummy treatment in which heat treatment is carried out on a dummy wafer and a susceptor or other structure in a chamber is temperature controlled, the reflectivity of the surface of the dummy wafer is measured. If the measured reflectivity falls outside a prescribed range, the dummy wafer is not a normal dummy wafer, so an alarm is activated and, furthermore, the dummy treatment is suspended. Thus, the occurrence of a problem resulting from a dummy wafer, a product wafer, or the like in which degradation has progressed being erroneously subjected to dummy treatment can be prevented, and an appropriate dummy treatment can be carried out on a normal dummy wafer.
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Inventors:
UENO TOMOHIRO (JP)
FUSE KAZUHIKO (JP)
OMORI MAO (JP)
FUSE KAZUHIKO (JP)
OMORI MAO (JP)
Application Number:
PCT/JP2019/043651
Publication Date:
May 28, 2020
Filing Date:
November 07, 2019
Export Citation:
Assignee:
SCREEN HOLDINGS CO LTD (JP)
International Classes:
H01L21/26; H01L21/265
Domestic Patent References:
| WO2016017685A1 | 2016-02-04 |
Foreign References:
| JP2009231652A | 2009-10-08 | |||
| JP2011049432A | 2011-03-10 | |||
| JP2001257167A | 2001-09-21 | |||
| JPS5056872A | 1975-05-17 |
Attorney, Agent or Firm:
YOSHITAKE Hidetoshi et al. (JP)
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