Title:
HEAT TREATMENT PROCESSING APPARATUS FOR BAND SAW
Document Type and Number:
WIPO Patent Application WO/2016/009478
Kind Code:
A1
Abstract:
[Problem] To provide a heat treatment processing apparatus capable of easily forming band saw leveling, which has required experience and intuition, by heat treatment. [Solution] A heat treatment processing apparatus for a band saw characterized: in being provided with upper and lower saw-feeding rollers (9) for causing the band saw to run, a burner (11) for heating the running band saw, a heat plate (10) for cooling the heated band saw, a cooling device (5) for delivering cooling water to the heat plate (10), a band saw-clamping handle (2) for moving the saw-feeding rollers (9) to clamp the running band saw, and a band saw forward and backward adjustment handle for moving the band saw running position; and in forming a narrow heat line on the band saw in the longitudinal direction by jetting the flame of the burner (11) on the running band saw and cooling the heated band saw using the cooled heat plate (10).
Inventors:
MOCHIZUKI HITOSHI (JP)
Application Number:
PCT/JP2014/068717
Publication Date:
January 21, 2016
Filing Date:
July 14, 2014
Export Citation:
Assignee:
SOTEC HAMAMATSU CO LTD (JP)
International Classes:
B23D63/00
Foreign References:
| JPH027916U | 1990-01-18 | |||
| JP2003053526A | 2003-02-26 | |||
| JPS63243223A | 1988-10-11 | |||
| JPS63243222A | 1988-10-11 | |||
| JPH1192828A | 1999-04-06 |
Attorney, Agent or Firm:
OHTA PATENT OFFICE (JP)
Patent business corporation Ota patent firm (JP)
Patent business corporation Ota patent firm (JP)
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