Title:
HEAT-TREATMENT-TYPE METHOD FOR FORMING ELECTROCONDUCTIVE COATING ON PASSIVE-STATE-FORMING LIGHT METAL
Document Type and Number:
WIPO Patent Application WO/2018/079188
Kind Code:
A1
Abstract:
A method for forming an electroconductive coating of silver, copper, tin, or the like via a base coating on a passive-state-forming light metal selected from aluminum, magnesium, and titanium, wherein the base coating is a nickel-phosphorus coating, the base coating is formed using a nickel-phosphorus electroplating bath including a predetermined soluble nickel salt, a compound including phosphorus, a complexing agent, a surfactant, a buffer, and a brightening agent, and the base coating or the base coating and the electroconductive coating are heat-treated under conditions including a temperature range of at least 30°C, whereby the adhesion of the base coating to the passive-state-forming light metal is increased relative to a method not including heat treatment, and the electroconductive coating can be formed with stronger adhesion on the passive-state-forming light metal.
Inventors:
FUJIWARA MASAHIRO (JP)
YAMAMOTO KAZUYUKI (JP)
YAMAMOTO KAZUYUKI (JP)
Application Number:
PCT/JP2017/035477
Publication Date:
May 03, 2018
Filing Date:
September 29, 2017
Export Citation:
Assignee:
ISHIHARA CHEMICAL CO LTD (JP)
International Classes:
C25D5/30
Foreign References:
| JP2010180457A | 2010-08-19 | |||
| JP2013237895A | 2013-11-28 | |||
| JPH08100273A | 1996-04-16 | |||
| JP2015206104A | 2015-11-19 | |||
| JP2014129560A | 2014-07-10 | |||
| JP2003239057A | 2003-08-27 |
Attorney, Agent or Firm:
ISEKI, Katsumori et al. (JP)
Download PDF: