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Patent Searching and Data


Title:
HEATER BOARD FOR FLOOR HEATING
Document Type and Number:
WIPO Patent Application WO/2005/116529
Kind Code:
A1
Abstract:
A heater board (1) for floor heating, wherein a soaking material (15) formed of a metal plate or a metal foil is installed at least on the upper surface thereof. The heater board is characterized in that a sacrificial layer (16) stuck by using an adhesive agent with an adhesive strength of 2 to 10 N/cm by the 90° peeling method specified in JIS Z0237 is formed on the upper surface of the soaking material (15), and the soaking material (15) is adhered to a heater board body (1') by using an adhesive agent with an adhesive strength larger than that of the adhesive agent used for adhering the sacrificial layer (16). When the re-construction of a floor finishing material is required, also the peeling of the floor finishing material is enabled without damaging the laid down heater board laid down, particularly the soaking material disposed on the upper surface of the heater board, and the heater board can be used without any modification.

Inventors:
HORI KOUJI (JP)
KOJIMA AKIYOSHI (JP)
FUKUDA YOSHIHIRO (JP)
Application Number:
PCT/JP2005/009627
Publication Date:
December 08, 2005
Filing Date:
May 26, 2005
Export Citation:
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Assignee:
NIPPON OIL CORP (JP)
HORI KOUJI (JP)
KOJIMA AKIYOSHI (JP)
FUKUDA YOSHIHIRO (JP)
International Classes:
E04F15/18; F24D13/02; H05B3/28; (IPC1-7): F24D13/02
Foreign References:
JP2003039338A2003-02-13
JP2000065366A2000-03-03
JP2004149717A2004-05-27
Attorney, Agent or Firm:
Miyazaki, Teruo (16th Kowa Bldg. 9-20, Akasaka 1-chom, Minato-ku Tokyo 52, JP)
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