Title:
HEATER SUBSTRATE, SUBSTRATE FOR PROBE CARD, AND PROBE CARD
Document Type and Number:
WIPO Patent Application WO/2021/153461
Kind Code:
A1
Abstract:
A heater substrate comprising an insulated substrate having a first surface and a second surface that is on the opposite side from the first surface, a heater wire positioned within the insulated substrate, and an adjustment unit that is electrically connected to the heater wire. The adjustment unit has a pair of adjustment terminals that are positioned on the second surface and are respectively electrically connected to the two ends of a partial section of the heater wire, and an adjustment conductor that is positioned on the second surface and connected to the pair of adjustment terminals. Also provided are a substrate for a probe card and a probe card that are equipped with the heater substrate.
Inventors:
TEGA HITOSHI (JP)
HASEGAWA TAKESHI (JP)
HASEGAWA TAKESHI (JP)
Application Number:
PCT/JP2021/002299
Publication Date:
August 05, 2021
Filing Date:
January 22, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05B3/02; G01R1/067; G01R1/073; G01R31/26; G01R31/28; H01L21/66; H05B3/20; H05B3/28
Foreign References:
| JP2017201669A | 2017-11-09 | |||
| JP2002184558A | 2002-06-28 | |||
| JP2011069759A | 2011-04-07 | |||
| US20020017916A1 | 2002-02-14 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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