Title:
HEATER SUBSTRATE, SUBSTRATE FOR PROBE CARD, AND PROBE CARD
Document Type and Number:
WIPO Patent Application WO/2021/166732
Kind Code:
A1
Abstract:
A heater substrate comprising an insulation substrate having a first surface and a second surface that is on the opposite side from the first surface, and at least one spiral-shaped heating body that includes a plurality of heater wires and that is positioned on the insulation substrate. The spiral-shaped heating body has at least one adjustment part including a fold-back of all or some of the plurality of heater wires. The plurality of heater wires include a first heater wire and a second heater wire adjacent to the inside of the first heater wire. The length of the first heater wire in the adjustment part is smaller than the length of the second heater wire in the adjustment part.
Inventors:
JINGU DAISUKE (JP)
TANAKA HIDENORI (JP)
TANAKA HIDENORI (JP)
Application Number:
PCT/JP2021/004702
Publication Date:
August 26, 2021
Filing Date:
February 09, 2021
Export Citation:
Assignee:
KYOCERA CORP (JP)
International Classes:
H05B3/10; G01R1/073; H01L21/66; H05B3/18; H05B3/20
Foreign References:
| US20160205726A1 | 2016-07-14 | |||
| JP2006228742A | 2006-08-31 | |||
| JP2011069759A | 2011-04-07 | |||
| JP2016500899A | 2016-01-14 | |||
| JP2000228270A | 2000-08-15 |
Attorney, Agent or Firm:
ARAFUNE, Hiroshi et al. (JP)
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