Title:
HEATER TIP FOR THERMOCOMPESSION BONDING
Document Type and Number:
WIPO Patent Application WO/2003/097288
Kind Code:
A1
Abstract:
A heater tip for thermocompression bonding capable of eliminating the possibilities of separation of the thermo-detecting part of a thermocouple and breakage of leads by heating and vibration, wherein a set of power terminal parts, a heat-pressure welded part (2) heated by an energization resistance, and a part for a thermocouple for temperature control are provided in a small plate piece (1) manufactured by forging a tungsten alloy, a cutout part (5) for inserting the connected end part of the thermocouple (6) is recess-formed near the heat-pressure welded part (2) starting from the edge part of the small plate piece, and the thermo-detecting part (7) formed by thermally fusing the connected end part is fitted to the small plate piece so as to cover the side end face of the small plate piece and the mouth edge part of the cut-in part.
Inventors:
ISHII TATSUYA (JP)
Application Number:
PCT/JP2003/004597
Publication Date:
November 27, 2003
Filing Date:
April 11, 2003
Export Citation:
Assignee:
KOBO PDA CO LTD (JP)
ISHII TATSUYA (JP)
ISHII TATSUYA (JP)
International Classes:
B23K3/03; B23K3/04; B23K3/047; (IPC1-7): B23K3/047
Foreign References:
| EP1136170A1 | 2001-09-26 | |||
| JPS5816540A | 1983-01-31 |
Attorney, Agent or Firm:
Matsunami, Yoshifumi c/o Matsunami, Patent Attorneys Office (19-4 Chiyoda 2-chome, Naka-k, Nagoya-shi Aichi, JP)
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