Title:
HEATING APPARATUS AND ANNEALING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/111659
Kind Code:
A1
Abstract:
Disclosed is a heating apparatus which is provided with an LED module (54) that has: a heat dissipating substrate (72) which is composed of a metal; an insulating layer (74) which is directly formed on the heat dissipating substrate; a plurality of wiring elements (76) which are arranged on the insulating layer and form a wiring pattern; a plurality of LED elements (70) which are provided on the wiring elements, respectively; and a metal wiring line (82) which electrically connects the adjacent LED elements to each other in series. With such configuration, heat of the LED elements can be uniformly and efficiently dissipated.
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Inventors:
SUZUKI TOMOHIRO (JP)
OOYA KAZUHIRO (JP)
YONEDA MASATAKE (JP)
OOYA KAZUHIRO (JP)
YONEDA MASATAKE (JP)
Application Number:
PCT/JP2011/055260
Publication Date:
September 15, 2011
Filing Date:
March 07, 2011
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
SUZUKI TOMOHIRO (JP)
OOYA KAZUHIRO (JP)
YONEDA MASATAKE (JP)
SUZUKI TOMOHIRO (JP)
OOYA KAZUHIRO (JP)
YONEDA MASATAKE (JP)
International Classes:
H01L21/26; C23C4/10; C23C14/50; C23C14/58; C23C16/46; H01L21/265; H01L33/64
Foreign References:
| JP2009295953A | 2009-12-17 | |||
| JP2005536045A | 2005-11-24 |
Attorney, Agent or Firm:
KATSUNUMA Hirohito et al. (JP)
Katsunuma Hirohito (JP)
Katsunuma Hirohito (JP)
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Claims:
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