Title:
HEATING APPARATUS AND COOLING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2011/135737
Kind Code:
A1
Abstract:
Disclosed are a heating apparatus and a cooling apparatus, whereby a whole printed substrate can be uniformly and stably heated or cooled without minutely increasing or reducing the temperature of the printed substrate while the printed substrate is being heated or cooled.
A plurality of blowing nozzles (2) are disposed in zigzag arrangement at a predetermined angle (θ) (θ is 15 degrees or less) with respect to the transfer direction (E) of the printed substrate by having the adjacent blowing nozzles (2) at same intervals (L), thereby making it possible to uniformly spray a gas to the whole printed substrate. A reflow apparatus (100) can stably heat or cool the whole printed substrate without minutely increasing or reducing the temperature of the printed substrate while the printed substrate is being heated or cooled. As a result, heating efficiency and cooling efficiency of the printed substrate can be improved, and a possibility of generating a soldering failure can be reduced.
Inventors:
KAGAYA TOMOTAKE (JP)
Application Number:
PCT/JP2010/064495
Publication Date:
November 03, 2011
Filing Date:
August 26, 2010
Export Citation:
Assignee:
SENJU METAL INDUSTRY CO (JP)
KAGAYA TOMOTAKE (JP)
KAGAYA TOMOTAKE (JP)
International Classes:
H05K3/34; B23K1/008; B23K3/04
Domestic Patent References:
| WO2006013895A1 | 2006-02-09 |
Foreign References:
| JP2005028424A | 2005-02-03 | |||
| JPH1093232A | 1998-04-10 | |||
| JP2004195476A | 2004-07-15 |
Attorney, Agent or Firm:
YAMAGUCHI INTERNATIONAL PATENT FIRM (JP)
Patent business corporation Yamaguchi international patent firm (JP)
Patent business corporation Yamaguchi international patent firm (JP)
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Claims: