Field of the Invention

This invention relates to a heating apparatus for a domestic or commercial building. In particular, the invention relates to a heating apparatus which provides computer processing resource as a by-product of the heating process.

Background to the Invention

Domestic and commercial buildings are commonly provided with a heating apparatus to satisfy the heating needs of the building, for example for space heating of rooms in the building and/or for providing a hot water supply. Such an apparatus is typically designed solely for the purpose of converting the stored energy content of a fuel, such as natural gas or a petroleum derivative, into thermal energy. In recent years there has been a focus on increasing the efficiency of this energy conversion process.

In parallel with the focus on improving the efficiency of heating apparatuses, the provision of computer systems in domestic and commercial buildings has become more widespread. Furthermore, the processing power of such computer systems has rapidly increased, with computer systems finding application in all aspects of the use of buildings.

It has been proposed in GB 2474248 A to employ a computer system as a heating apparatus. In particular, the computer system comprises a processor which is configured to implement stored instructions to thereby produce thermal energy. The thermal energy can be used for domestic or commercial heating purposes, with the computer processing resource forming a useful by-product that effectively raises the commercial and energy efficiency of the apparatus.

Although the heating apparatus disclosed in GB 2474248 A is capable of efficient operation, the inventors have identified a number of problems which may arise when configuring a computer system as a heating apparatus. A significant issue relates to the need, in many implementations, for a fluid medium to be heated to a relatively high temperature.

For example, when heating and storing water for domestic or commercial consumption, pathogens such as Legionella can develop at water temperatures of less than 49°C. Further, to provide for stratification (layering of hot and cold water) in a water storage vessel, the heat exchanger (for example, a water heating coil) typically needs to be maintained at a temperature of at least 56°C. However, the temperature to which the water can be heated by the apparatus of GB 2474248 A is limited by the temperature of the processor. That is to say, unless a heat pump and/or supplementary heating means are utilised, the water cannot be heated to a temperature any higher than that of the processor. In practice, the maximum temperature to which the water can be heated is several degrees lower than that of the processor.

Accordingly, when using a computer system for heating purposes, it is generally desirable to operate the computer processor at as high a temperature as possible. However, operation of the computer processor at a high temperature can limit its computer processing performance and, over extended periods, lead to premature failure of the processor.

Summary of the Invention

The following aspects of the invention address the above-identified problem.

According to a first aspect of the invention, there is provided a heating apparatus for a domestic or commercial building, the apparatus comprising:

a computer system for installation in the building, the computer system including a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy; and

a thermal energy distribution assembly arranged for transferring the thermal energy away from the computer system for heating purposes, the thermal energy distribution assembly comprising a piped fluid circuit and at least one first heat exchanger connected to the piped fluid circuit for transferring the thermal energy from the processor to a fluid of the piped fluid circuit,

wherein the piped fluid circuit is arranged such that, before passing through the first heat exchanger, thermal energy is transferred to the fluid from thermal energy-generating ancillary components of the computer system.

The inventors have observed that, in general, the processor of a computer system operates at a relatively high temperature. Thermal energy can be efficiently transferred away from the processor using a first heat exchanger arranged between the processor and a piped fluid circuit. By comparison, ancillary components of the computer system, such as power supply components and memory devices, also tend to produce thermal energy, but operate at a lower temperature than that of the processor. The inventors have discovered that the heating system can be configured to heat a fluid medium to a relatively high temperature by transferring the thermal energy from the ancillary components to the fluid before the fluid passes through the first heat exchanger (associated with the processor). In this way, the fluid can be heated to an intermediate temperature by the ancillary components operating at a lower temperature, before being further heated to a final temperature by the processor operating at a higher temperature.

The order in which the fluid is heated by the ancillary components and the processor according to the first aspect of the invention has been found to be particularly important, since the fluid cannot be heated to as high a temperature if the fluid is heated by the processor before being heated by the ancillary components.

As used herein, the expression "before passing through the first heat exchanger" means directly before passing through the first heat exchanger, in the sense that, after the thermal energy has been transferred to the fluid from the ancillary components, thermal energy is not then transferred away from the fluid until after it has passed through the first heat exchanger. In other words, any further heat exchanger for transferring thermal energy away from the fluid, for heating purposes, is arranged in the piped fluid circuit such that the fluid passes through the further heat exchanger after passing through the first heat exchanger and before the thermal energy is transferred to the fluid from the ancillary components.

In embodiments of the invention, the first heat exchanger is typically a separate component that is attached to the processor (package), either directly or indirectly via a thermally conductive medium such as a thermal grease. However, in some embodiments the first heat exchanger may be an integral part of the processor. For example, the processor may be embodied as a so-called three-dimensional chip in which heat exchanger fluid channels are integrally formed adjacent to or in between a plurality of processor cores. Alternatively, the first heat exchanger may be physically separated from the processor (package) but in close functional vicinity, for example within 5 mm, preferably within 2 mm, and most preferably within 0.5 mm.

In embodiments, the thermal energy is preferably transferred from the ancillary components of the computer system via a bulk dielectric fluid in which the ancillary components are immersed. Such dielectric fluids are known in the art, for example from WO 2017/055877 A1 , the entire contents of which is incorporated herein. In essence, the dielectric fluid directly contacts the ancillary components, and the thermal energy is transferred to the fluid primarily by conduction. The dielectric fluid may be agitated or circulated in some way to improve the efficiency of the thermal energy transfer. The ancillary components may be attached to at least one circuit board, which is immersed in the dielectric fluid. In certain embodiments, the processor, for example together with the attached first heat exchanger, may also be immersed in the dielectric fluid, for example as part of a so-called motherboard (optionally also carrying the ancillary components). In this way, thermal energy from the processor which is not captured by the first heat exchanger can instead be captured by the dielectric fluid, thereby further improving the efficiency of the apparatus.

The thermal energy distribution assembly according to the invention may further comprise a further heat exchanger connected to the piped fluid circuit for transferring the thermal energy from the ancillary components to the fluid of the piped fluid circuit. For example, the second heat exchanger may be arranged within a bulk enclosure containing the ancillary components and the bulk dielectric fluid mentioned above, such that the second heat exchanger can transfer the thermal energy from the dielectric fluid to the fluid of the piped fluid circuit.

Alternatively, the bulk dielectric fluid may also be the fluid of the piped fluid circuit, so that the dielectric fluid is arranged to flow directly from a bulk enclosure containing the ancillary components into the piped fluid circuit, and then into the first heat exchanger. In this arrangement, no further heat exchanger is needed.

In a specific embodiment, at least one, and optionally both, of the first and second heat exchangers are arranged in a wall of the bulk enclosure. For example, at least the first heat exchanger may form an integral part of the wall, and the processor may then be arranged within the enclosure in close vicinity or in contact with the first heat exchanger. In this way, the number of separate components of the apparatus can be reduced.

In embodiments, the thermal energy distribution assembly may further comprise a shaped insert, for example a moulded plastics insert, immersed in the dielectric fluid. In this way, a total volume of the dielectric fluid may be minimised, so that a given amount of thermal energy transferred from the ancillary components causes a relatively greater increase in the temperature of the dielectric fluid.

According to the invention, the computer system may comprise a plurality of processors and respective first heat exchangers, wherein the piped fluid circuit comprises parallel routes, and wherein different first heat exchangers are connected to different ones of the parallel routes. In this way, the temperature of the fluid passing through the different first heat exchangers may be approximately the same, so that the rate of thermal energy transfer is also approximately the same. In some embodiments, multiple heat exchangers may be coupled by a combination of parallel and series routes selected so as to manage (for example, limit) temperature variations in the fluid passing through the different heat exchangers. In all of these embodiments, the piped fluid circuit typically includes at least a pair of forked connections arranged (immediately) upstream and (immediately) downstream, respectively, of the first heat exchangers. The forked connections define opposite ends of the parallel routes. Further, at least one valve may be provided to control or vary the flow rate of fluid through the parallel routes, to thereby allow the rate of thermal energy transfer from different processors to be dynamically controlled, for example in response to processor loading.

In embodiments of the invention, the thermal energy distribution assembly further comprises a pump arranged to pump the fluid of the piped fluid circuit, such that the thermal energy from the ancillary components is transferred to the fluid before the thermal energy from the processor is transferred to the fluid.

The processor may be at least one of a central processing unit (CPU), a graphics processing unit (GPU) and a gate array. In general, the term "processor" herein refers to the physical package containing a processor. However, in the context of a processor having an integral first heat exchanger, the term "processor" may refer to a functional unit, such as a processing core, within such a package.

The ancillary components may comprise at least one of a storage device, such as for the data store or the program store of the computer system, or a power supply component, or indeed any heat-generating component that is in some way associated with the computer system.

According to the invention, the thermal energy distribution assembly may further comprise a further heat exchanger connected to the piped fluid circuit, the further heat exchanger being arranged to transfer thermal energy away from the fluid of the piped fluid circuit for domestic or commercial heating, optionally for heating water for domestic or commercial consumption.

In this context, domestic or commercial consumption refers to the deliberate discharge of heated water from a domestic or commercial water system. For instance, this could include the process of heated water being released from a showerhead or faucet. Conversely, this definition does not include such processes as heated water being released from an overflow valve, which is generally an automatic and non-deliberate process. According to a second aspect of the invention, there is provided a use of the heating apparatus described above, wherein:

the bulk dielectric fluid is maintained at a temperature of 10°C to 60°C; and the processor is maintained at a temperature of 40°C to 90°C,

wherein the temperature of the processor is at least 20°C, and optionally at least 30°C, higher than the temperature of the bulk dielectric fluid.

According to a third aspect of the invention, there is provided a method of heating a domestic or commercial building using a computer system installed in the building, the computer system including a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy, the method comprising:

operating the computer system to produce thermal energy;

transferring the thermal energy away from the computer system for a heating purpose using a thermal energy distribution assembly, the thermal energy distribution assembly comprising a piped fluid circuit and a plurality of heat exchangers connected to the piped fluid circuit;

determining whether there is a need for an increased heating temperature; and in response to the determination of a need for an increased heating temperature, controlling at least one of a rate at which the computer system produces the thermal energy and a rate at which the thermal energy distribution assembly transfers thermal energy away from the processor such that the temperature of the processor increases.

In a generally preferred embodiment of the invention, the increase in the temperature of the processor is achieved by controlling at least the rate at which the thermal distribution assembly transfers thermal energy away from the processor.

In embodiments of the invention, the method may further comprise heating water in a hot water supply system.

Although the processor of a computer system typically operates at a relatively high temperature, the inventors have recognised that an even higher operating temperature would be desirable for certain types of heating, for example for heating hot water. The inventors have discovered that a computer processor can be operated at the high temperature desired for these heating applications without significantly reducing the lifespan of the processor and/or its processing performance, in particular by selectively operating the processor at the higher temperature when there is a need for an increased heating temperature, for example when there is a need to heat water for domestic or commercial consumption. At such times, the temperature of the processor may be increased to at least 60°C, at least 70°C, at least 80°C, or even at least 90°C.

At other times, for example when it is determined that there is no need for heating and/or a need only for space heating (or other less demanding heating applications), the temperature of the processor may be decreased to less than 60°C, or 55°C or less, optionally 45°C or less. At these lower temperatures, the processor's lifespan and processing performance may be optimised.

According to embodiments of the invention, the rate at which the thermal energy distribution assembly transfers thermal energy away from the processor may be controlled by at least one of:

varying the flow rate in the piped fluid circuit;

varying the volume of fluid in the piped fluid circuit; and

varying the thermal energy transfer efficiency of at least one of the heat exchangers (for example by altering the length of the fluid path through the heat exchanger).

In embodiments of the invention, the rate at which the computer system produces the thermal energy and/or a rate at which the thermal energy distribution assembly transfers thermal energy away from the processor may be dynamically controlled to maintain the processor at a predefined temperature. For this purpose, the processor may be provided with a temperature sensor, and the processor may be maintained at the predetermined temperature by closed-loop control.

According to a fourth aspect of the invention, there is provided a heating apparatus for a domestic or commercial building, the apparatus comprising:

a computer system for installation in the building, the computer system including a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy,

a thermal energy distribution assembly arranged for transferring the thermal energy away from the computer system for heating purposes, the thermal energy distribution assembly comprising a piped fluid circuit and a plurality of heat exchangers connected to the piped fluid circuit; and

a controller for controlling the operation of the computer system and/or the thermal energy distribution assembly, the controller being arranged and configured to: determine whether there is a need for an increased heating temperature; and in response to the determination of a need for an increased heating temperature, control at least one of a rate at which the computer system produces the thermal energy and a rate at which the thermal energy distribution assembly transfers thermal energy away from the processor, such that the temperature of the processor increases.

Although the invention has been summarised above with reference to four aspects, any of these aspects may be combined together. Thus, for example, the heating apparatus of the first aspect may be operated according to the method of the third aspect. Such a combination provides synergistic effects with combine to maximise the achievable heating temperature.

Brief Description of the Drawings

Exemplary embodiments of the invention will now be described, by way of example only, with reference to the accompanying drawings, in which:

Fig. 1 is a schematic view of a first embodiment of the invention in the form of a heating apparatus;

Fig. 2 is a schematic view of a second embodiment of the invention in the form of a heating apparatus; and

Fig. 3 is a flow chart illustrating a third embodiment of the invention in the form of an method of operating a heating apparatus.

Detailed description of the embodiments

The invention provides a heating apparatus for a domestic or commercial building. The apparatus comprises a computer system for installation in the building, the computer system including a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy. The apparatus further comprises a thermal energy distribution assembly arranged for transferring the thermal energy away from the computer system for heating purposes, the thermal energy distribution assembly comprising a piped fluid circuit and at least one first heat exchanger connected to the piped fluid circuit for transferring the thermal energy from the processor to a fluid of the piped fluid circuit.

According to the invention, the piped fluid circuit may be arranged such that, before passing through the first heat exchanger, thermal energy is transferred to the fluid from thermal energy-generating ancillary components of the computer system. Alternatively, or additionally, the apparatus may be operated such that, in response to the determination of a need for an increased heating temperature, at least one of a rate at which the computer system produces the thermal energy and a rate at which the thermal energy distribution assembly transfers thermal energy away from the processor is controlled, such that the temperature of the processor increases.

Fig. 1 illustrates, in generalised schematic form, a first embodiment of the invention in the form of a heating apparatus 1 for a domestic or commercial building (not specifically shown in the drawings). Such an apparatus 1 is typically used for space heating, for example in cool climates, and/or for producing hot water for consumption, for example for washing purposes. The hot water is conventionally stored in a hot water vessel so that it is ready for use when needed.

The heating apparatus 1 firstly comprises a computer system 3 for installation in the building. The computer system 3 may be substantially conventional in design and includes electronic circuits providing a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions, to thereby produce thermal energy.

In the illustrated embodiment, the computer system 3 comprises four processors 5a, 5b, 5c, 5d, although other embodiments may be provided with fewer processors, including a single processor, or a greater number of processors. In general, a plurality of processors is provided, and a greater number of processors is preferred, since this facilitates the production of larger amounts of thermal energy which can then be used for heating purposes. The computer system 3 may be implemented as a standard personal computer, although arrangements having multiple high-powered processors are particularly favoured. The processors 5a, 5b, 5c, 5d may include central processing units (CPUs), graphics processing units (GPUs), gate arrays (such as FPGAs), or any combination of these.

Each of the processors 5a, 5b, 5c, 5d illustrated in Fig. 1 is in the form of a single physical processor package. In the illustrated embodiment, each processor 5a, 5b, 5c, 5d includes multiple processor cores, as is known in the art. The processors 5a, 5b, 5c, 5d are electrically connected to respective circuit boards in the form of so-called motherboards 7a, 7b, 7c, 7d. The motherboards 7a, 7b, 7c, 7d also carry a number of ancillary heat-generating components, such as volatile and non-volatile memory devices 9a, 9b, 9c, 9d which provide the data and program stores mentioned above. The computer system 3 is also provided with other ancillary heat-generating components, such as power supply components and communications interface components (not shown in Fig. 1 ).

The motherboards 7a, 7b, 7c, 7d, and optionally other ancillary heat-generating components, are contained within a bulk enclosure 17. The bulk enclosure 17 is essentially liquid-sealed, but the top and side have been omitted in Fig. 1 to allow the interior or the enclosure to be seen.

In use, the computer system 3 produces thermal energy. In particular, a large amount of thermal energy is produced by the processors 5a, 5b, 5c, 5d, which typically operate at a relatively high temperature, and a lesser amount of thermal energy is produced by the ancillary components, which typically operate at a somewhat lower temperature. For example, the processors may operate at a temperature of at least 50°C and the ancillary components may operate at a temperature of less than 50°C. According to the invention, the heating apparatus 1 is also provided with a thermal energy distribution assembly 1 1 for transferring the thermal energy away from the computer system 3 for heating purposes.

The thermal energy distribution assembly 1 1 comprises a piped fluid circuit 13 carrying a fluid. The fluid preferably has a high thermal conductivity and specific heat capacity so that it can efficiently transfer thermal energy away from the computer system 3. The thermal energy distribution assembly 1 1 also comprises a plurality of first heat exchangers 15a, 15b, each of which is attached to a respective pair of the processors 5a, 5b, 5c, 5d. The heat exchangers 15a, 15b are connected to the piped fluid circuit 13 for transferring the thermal energy from the processors 5a, 5b, 5c, 5d to a fluid of the piped fluid circuit 13.

The heat exchangers 15a, 15b are typically formed of a thermally conductive material, such as a metal. In the illustrated embodiment, they are directly attached to the respective processor pairs 5a, 5b, 5c, 5d, such that thermal energy can be conducted from the processors to the heat exchangers. Each of the heat exchangers 15a, 15b is provided with a network of internal fluid channels which are connected into the piped fluid circuit 13 to enable thermal energy to be transferred to the fluid when it passes through the channels. The design of the heat exchangers 15a, 15b is essentially conventional. In alternative embodiments, the heat exchangers may be an integral part of the processor packages (for example, in the case of so-called three-dimensional chip packages), indirectly attached to the processors via a thermally conductive medium (such as a thermal grease), or merely arranged in the vicinity of the processors (for example where the motherboards are immersed in a thermally-conductive dielectric fluid). In alternative embodiments, each processor may be provided with its own heat exchanger.

In the illustrated embodiment, the piped fluid circuit 13 comprises two parallel routes 19a, 19b each connected to a respective heat exchanger 15a, 15b. The provision of the parallel routes 19a, 19b allows for the fluid passing through each of the heat exchangers 15a, 15b to be maintained at similar input and output temperatures, such that the thermal energy transfer from the processors 5a, 5b, 5c, 5d to the fluid can be maintained at a similar rate. Forked connections with valves 21 a, 21 b are provided immediately upstream and downstream of the heat exchangers 15a, 15b. The valves 21 a, 21 b may be dynamically controlled to adjust the flow rate of the fluid in each of the parallel routes 19a, 19b, and thereby control the rate at which thermal energy is transferred away from the respective processors 5a, 5b, 5c, 5d. For example, the valves 21 a, 21 b may be used to maintain the processors 5a, 5b, 5c, 5d at a desired temperature.

In alternative embodiments, any number of parallel routes 19a, 19b may be provided in the piped fluid circuit 13. The heat exchangers 15a, 15b may be connected to the piped fluid circuit 13 by any combination of parallel and series connections.

The thermal energy distribution assembly 1 1 according to the invention also comprises a bulk dielectric fluid 23 arranged within the bulk enclosure 17. At least parts of the motherboards 7a, 7b, 7c, 7d, including the thermal energy-generating ancillary components 9a, 9b, 9c, 9d, are immersed in the dielectric fluid 23 such that thermal energy can be efficiently conducted away from the ancillary components to the dielectric fluid 23. A suitable dielectric fluid is known in the art, for example from WO 2017/055877 A1.

Further examples of fluids suitable for use as both the bulk dielectric fluid 23 and also as a fluid within piped fluid circuit 13 include white mineral oil and chemically engineered liquids, for example hydrofluoroether compounds (HFEs). Additionally, water is also suitable for use within the piped fluid circuit.

The dielectric fluid 23 arranged within the bulk enclosure 17 may be agitated in some way so that its temperature is reasonably consistent throughout its volume. Alternatively, the dielectric fluid may be not agitated, and the computer system 3 may be configured such that the temperature of the dielectric fluid 23 varies throughout its volume. A moulded plastics insert (not shown) may be positioned in the bulk enclosure 17 to minimise the volume of dielectric fluid 23 needed to immerse the components of the computer system 3. In this way, a temperature of the dielectric fluid 23 may be raised, as compared to an arrangement having a larger volume of the fluid.

The thermal energy distribution assembly 1 1 according to the invention further comprises a second heat exchanger 25 connected to the piped fluid circuit 13 for transferring the thermal energy from the ancillary components 9a, 9b, 9c, 9d, via the dielectric fluid 23, to the fluid of the piped fluid circuit 13. The second heat exchanger 25 is arranged within the bulk enclosure 17 so as to be immersed in the bulk dielectric fluid 23. The second heat exchanger 25 may be arranged in a position where the temperature of the dielectric fluid 23 is relatively high due to convention currents, for example immediately above the motherboards 9a, 9b, 9c, 9d. In an alternative embodiment, the second heat exchanger 25 may be arranged in a wall of the bulk enclosure 17, for example integrated into the wall.

The second heat exchanger 25 is arranged in series with the first heat exchangers 15a, 15b. According to the invention, the piped fluid circuit 13 is arranged and configured such that, before passing through the first heat exchangers 15a, 15b, the fluid in the circuit 13 passes through the second heat exchanger 25. A pump (not shown) may be provided for this purpose.

In use of the heating apparatus 1 , the dielectric fluid 23 may be maintained at a temperature of from 10°C to 60°C by transferring thermal energy to it from the ancillary components 9a, 9b, 9c, 9d. The processors 5a, 5b, 5c, 5d may be maintained at a temperature of 40°C to 90°C. Typically, temperature of the processors 5a, 5b, 5c, 5d is at least 20°C, and optionally at least 30°C, higher than the temperature of the dielectric fluid 23.

By initially passing the fluid of the piped fluid circuit 13 through the second heat exchanger 25 and only then through the first heat exchangers 15a, 15b, a temperature of the fluid exiting the series of heat exchangers 15a, 15b, 25 can be maximised. In particular, fluid is heated to an intermediate temperature by the second heat exchanger 25 and then heated to a final temperature by the first heat exchangers 15a, 15b. A higher temperature can be achieved, as compared to a flow in the reverse direction, because the final temperature is achieved using the heat exchangers 15a, 15b operating at a highest temperature.

In an alternative embodiment, which is not illustrated, the second heat exchanger 25 can be omitted and the dielectric fluid 23 can be used as the fluid of the piped fluid circuit 13. In this arrangement, thermal energy is directly transferred from the ancillary components 9a, 9b, 9c, 9d to the fluid of the piped fluid circuit 13. The heating apparatus 1 typically further comprise a further heat exchanger (not shown) connected to the piped fluid circuit 13 between the outlets of the first heat exchangers 15a, 15b, and the inlet of the second heat exchanger 25. The further heat exchanger is arranged to transfer thermal energy away from the fluid of the piped fluid circuit 13 for domestic or commercial heating purposes, for example to heat water for domestic or commercial consumption.

Fig. 2 illustrates, in generalised schematic form, a second embodiment of the invention in the form of a heating apparatus 101 for a domestic or commercial building. Such an apparatus 101 is typically used for space heating, for example in cool climates, and for producing hot water for consumption, for example for washing purposes. The hot water is stored in a hot water vessel 102 so that it is ready for use when needed.

The heating apparatus 101 of Fig. 2 is broadly similar to the heating apparatus 1 shown in Fig 1 . Like features, which have corresponding reference numerals in the drawings, will not therefore be described in detail. In summary, the apparatus 101 comprises a computer system 103, which includes a data store, a program store storing processor implementable instructions, and at least one processor coupled to the data and program stores for implementing the stored instructions to thereby produce thermal energy. In the illustrated embodiment there are four processors 105a, 105b, 105c, 105d. The processors 105a, 105b, 105c, 105d are provided with temperature sensors (not shown).

The computer system 103 also comprises a plurality of ancillary components 109 similar to those of computer system 3 illustrated in Fig. 1.

The apparatus 1 also comprises a thermal energy distribution assembly 1 1 1 arranged for transferring the thermal energy away from the computer system 103 for heating purposes. The thermal energy distribution assembly 1 1 1 comprising a piped fluid circuit 1 13, a plurality of heat exchangers 1 15a, 1 15b, 131 , and a pump 133 connected to the piped fluid circuit 1 13.

In the embodiment shown in Fig. 2, there is a further piped fluid circuit 135, which is coupled in series to the first piped fluid circuit 1 13 such that the heat exchanger 131 is arranged between the circuits, the heat exchanger 131 transferring thermal energy between the two circuits 1 13 and 135. The further piped fluid circuit 135 is similar to that which can be found in many conventional heating systems and is used to transfer thermal energy from a heat source (for example, the heat exchanger 131 ) to where the thermal energy is needed in the building (e.g. hot water vessel 102), via another heat exchanger (for example, arranged as a heating coil within the hot water vessel 102 and not specifically shown in Fig. 2).

The apparatus 101 of Fig. 2 also comprises an electronic controller 141 , which is connected to the computer system 103 (for example, to processors 105a, 105b, 105c, 105d) and the thermal energy distribution assembly 1 1 1 (for example, to pump 133) for controlling the operation of the computer system and/or the thermal energy distribution assembly 1 1 1. The controller 141 may be a separate component of the apparatus 101 or may be implemented as a part of the computer system 103 (for example, as a software-based controller).

The controller 141 is arranged and configured to determine whether there is a need for an increased heating temperature, for example an increased fluid temperature in the piped fluid circuit 1 13 and/or the further piped fluid circuit 135. Such a need may arise when the heating apparatus 101 is being used to heat water for domestic or commercial consumption or, in particular, for the final stages of heating the water. The determination may be made based on the operation of user controls, a timing device, or a thermostatic controller.

Further, the controller 141 is arranged and configured to, in response to the determination of a need for an increased heating temperature, control the rate at which the computer system 103 produces the thermal energy and/or the rate at which the thermal energy distribution assembly 1 1 1 transfers the thermal energy away from the processors 105a, 105b, 105c, 105d, such that the temperature of the processors 105a, 105b, 105c, 105d increases. For example, the temperature of the processors may increase to at least 60°C, or even at least 70°C. The temperature of the processors may increase by at least 10°C. The controller may then maintain the processors 105a, 105b, 105c, 105d at any desired temperature using closed-loop control, for example by monitoring outputs of the processors' temperature sensors.

With the processors 105a, 105b, 105c, 105d operating at the increased temperature, the heating apparatus 101 is able to heat water to a higher temperature, for example to provide stratification in the hot water vessel 102 and prevent the development of pathogens within the vessel 102. However, operation of the processors at this temperature is in other ways compromised, since their processing performance and lifespan may be significantly reduced.

Accordingly, the controller 141 is further arranged and configured to determine whether there is no need for heating or a need only for space heating (or other less demanding heating applications). The determination may be based on the operation of user controls, a timing device, or a thermostatic controller.

Further, the controller 141 is arranged and configured to, in response to the determination of no need for heating or a need only for space heating, control the rate at which the computer system 103 produces the thermal energy and/or the rate at which the thermal energy distribution assembly 1 1 1 transfers thermal energy away from the processors 105a, 105b, 105c, 105d, such that the temperature of the processors 105a, 105b, 105c, 105d decreases. For example, the temperature of the processor may decrease to less than 60°C, or 55°C or less, or even 45°C or less. The temperature of the processors may decrease by at least 10°C. Such a temperature is typically adequate for space heating purposes (and other less demanding heating applications). It also allows for the processor performance and lifespan to be optimised.

In the heating apparatus shown in Fig. 2, the rate at which the thermal energy distribution assembly 1 1 1 transfers thermal energy away from the processors 105a, 105b, 105c, 105d may be controlled by varying the flow rate in the piped fluid circuits 1 13, 135, varying the volume of fluid in the piped fluid circuits 1 13, 135, and/or varying the thermal energy transfer efficiency of at least one of the heat exchangers 1 15a, 1 15b, 131 (including a heating coil within the hot water vessel 102). This will be achieved, for example, by dynamically changing the length of the fluid path through the heat exchanger.

Fig. 3 is a flow chart illustrating a third embodiment of the invention in the form of a method of operating the heating apparatus 101. Although the method is described with reference to the apparatus 101 , it could equally be applied to the apparatus 1 shown in Fig. 1 .

In a first step 201 , the computer system 103 is operated to produce thermal energy.

In a second step 202, the thermal energy produced by the computer system 103 is transferred away from the computer system 103 for a heating purpose using the thermal energy distribution assembly 1 1 1 .

In a third step 203, the controller 141 determines whether there is a need for an increased heating temperature, for example for heating water.

In a fourth step 204, the controller 141 , in response to the determination of a need for an increased heating temperature, controls the rate at which the computer system 103 produces the thermal energy and/or the rate at which the thermal energy distribution assembly 1 1 1 transfers thermal energy away from the processors, such that the temperature of the processors increases.

In a fifth step 205, the controller 141 determines whether there is no need for a reduced heating temperature , for example for space heating only, or no need for heating at all.

In a sixth step 206, the controller 141 , in response to the determination of a need for a reduced heating temperature, controls the rate at which the computer system 103 produces the thermal energy and/or the rate at which the thermal energy distribution assembly 1 1 1 transfers thermal energy away from the processors, such that the temperature of the processors decreases.

The method illustrated in Fig. 3 enables the heating apparatus 101 to be used for demanding heating applications, such as heating water to a high temperature, while at the same time maximising the processing performance and life span of the computer system, in particular the processors 105a, 105b, 105c, 105d.

Specific embodiments of the invention have been described above. However, various changes may be made to these embodiments without departing from the scope of the invention, which is defined by the claims (and, where applicable, their equivalents). Many such changes will be apparent to those skilled in the art.