HEATING DEVICE AND METHOD FOR MANUFACTURING SOLDERED OBJECT

Title:

HEATING DEVICE AND METHOD FOR MANUFACTURING SOLDERED OBJECT

Document Type and Number:

WIPO Patent Application WO/2020/218122

Kind Code:

A1

Abstract:

To provide a heating device with which the adhesion of dirt can be prevented with a simple configuration, and a method for manufacturing a soldered object. This heating device 1 is provided with: a chamber 11 in which an object W is accommodated; a stage 13 on which the object W is placed and which demarcates an internal space C inside the chamber 11 into a lower region Ce and an upper region Cf; a heating unit 15 that heats the object W on the stage 13; and gas supply devices 18, 19 that supply gases Ge, F to the lower region Ce. The chamber 11 has formed therein an outlet port 11p in the upper region Cf. The stage 13 forms gaps D that create a flow for allowing the gases Ge, F supplied to the lower region Ce by the gas supply devices 18, 19, to move from the lower region Ce to the upper region Cf along the side walls of the chamber 11. The method for manufacturing includes supplying the object W into the chamber 11, supplying the gas Ge that moves from the lower region Ce to the upper region Cf along the side walls of the chamber 11, and raising the temperature of the object W to perform soldering.

Inventors:

TAKEUCHI NANAMI (JP)
SHIRAISHI ARISA (JP)
OZAWA NAOTO (JP)
SUZUKI TAKAYUKI (JP)

Application Number:

PCT/JP2020/016609

Publication Date:

October 29, 2020

Filing Date:

April 15, 2020

Export Citation:

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Assignee:

ORIGIN CO LTD (JP)

International Classes:

B23K1/008; B23K3/00; B23K3/08; B23K31/02; H05K3/34

Foreign References:

JP2015100841A	2015-06-04
JPS53109738U	1978-09-02
JPH07202406A	1995-08-04
JP2005014074A	2005-01-20
JP2015100841A	2015-06-04
JP2019086132A	2019-06-06

Other References: