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Patent Searching and Data


Title:
HEATING DEVICE AND HEATING METHOD
Document Type and Number:
WIPO Patent Application WO/2019/105422
Kind Code:
A1
Abstract:
Disclosed are a heating device and a heating method thereof, wherein a sucking disc (32) is directly fixed to a heat insulation seat (35), a thin heater (34) hangs upside down from a lower surface of the sucking disc (32) via a soft fixing device (36), a force generated by thermal deformation of the heater (34) and the sucking disc (32) is delivered axially and downwardly, and the impact of the self-deformation of the heater (34) during heating on the height and flatness of the substrate (31) is reduced. A temperature homogenizing layer (33) is provided between the heater (34) and the sucking disc (32) to realize a uniform heat conduction between the heater (34) and the sucking disc (32), and a fixing layer (55) is provided on a lower surface of the heater (34) to prevent the heater (34) from warping due to the inability to transfer heat rapidly, which results in local heating of the heater. Meanwhile, the technical solution adopts a thin heater (34), the weight of the heating device is reduced, and the load requirement for a workbench is then reduced. Due to the decrease in the thickness of the heater (34), the heat capacity of the heater (34) is reduced, the heating and cooling cycle of the heating device is shortened, and the heating efficiency is improved.

Inventors:
CHENG JING (CN)
ZHU ZHI (CN)
Application Number:
PCT/CN2018/118260
Publication Date:
June 06, 2019
Filing Date:
November 29, 2018
Export Citation:
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Assignee:
SHANGHAI MICRO ELECTRONICS EQUIPMENT GROUP CO LTD (CN)
International Classes:
H01L21/67
Foreign References:
CN101261283A2008-09-10
CN201196654Y2009-02-18
US20070223175A12007-09-27
CN206194704U2017-05-24
Attorney, Agent or Firm:
SHANGHAI SAVVY INTELLECTUAL PROPERTY AGENCY (CN)
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