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Title:
HEATING DEVICE, SUBSTRATE HEATING DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/051494
Kind Code:
A1
Abstract:
This heating device is provided with a heater, an electron reflection plate, a filament disposed between the heater and the electron reflection plate, a heating power source for feeding an AC voltage between a first terminal and a second terminal of the filament and releasing thermoelectrons from the filament, an acceleration power source for feeding an acceleration voltage between the filament and the heater, and a resistor disposed so as to form a path connecting the electron reflection plate and the heating power source.

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Inventors:
SASAKI MASAO (JP)
YOSHIBAYASHI KAZUTOSHI (JP)
SATO KENJI (JP)
MURATA KENZOU (JP)
Application Number:
PCT/JP2016/077490
Publication Date:
March 22, 2018
Filing Date:
September 16, 2016
Export Citation:
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Assignee:
CANON ANELVA CORP (JP)
International Classes:
H05B7/144; H01L21/263; H01L21/324
Foreign References:
JP2008053066A2008-03-06
JP2009043951A2009-02-26
JP2014158009A2014-08-28
Attorney, Agent or Firm:
OHTSUKA, Yasunori et al. (JP)
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