Title:
HEATING DEVICE AND SUBSTRATE TREATMENT DEVICE
Document Type and Number:
WIPO Patent Application WO/2023/218963
Kind Code:
A1
Abstract:
This heating device is for heating a substrate placed directly or indirectly through another member and comprises: a linear heater; and a base material which has a recess in which the heater is fixed and which is recessed toward the substrate side from a side opposite to the substrate side. The groove has, on the proximal side, a contact part which comes into contact with the heater, and, on the distal side, a non-contact part which does not come into contact with the heater.
Inventors:
TSUDA EINOSUKE (JP)
Application Number:
PCT/JP2023/016465
Publication Date:
November 16, 2023
Filing Date:
April 26, 2023
Export Citation:
Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
H01L21/683; H01L21/31; H01L21/324
Foreign References:
| JP2006111973A | 2006-04-27 | |||
| JP2009535801A | 2009-10-01 | |||
| JP2006108011A | 2006-04-20 |
Attorney, Agent or Firm:
KANEMOTO, Tetsuo et al. (JP)
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