Title:
HEATING AND MELTING TREATMENT DEVICE AND HEATING AND MELTING TREATMENT METHOD
Document Type and Number:
WIPO Patent Application WO/2011/024813
Kind Code:
A1
Abstract:
Disclosed is a heating and melting treatment device which is capable of directly cooling an object to be treated, and which eliminates the need to dispose an additional cooling plate.
Specifically disclosed is a heating and melting treatment device (1) which applies an object (100) to be treated including solder to heating and melting treatment in an atmosphere including carboxylic acid vapor, wherein a hand section (4) for carrying the object (100) to be treated, which has been applied to the heating and melting treatment thereon is also used as a cooling plate.
Inventors:
ABE, Hideyuki (60, Kagumachi, Besshocho, Himeji-sh, Hyogo 25, 〒6710225, JP)
Application Number:
JP2010/064299
Publication Date:
March 03, 2011
Filing Date:
August 24, 2010
Export Citation:
Assignee:
AYUMI INDUSTRY CO., LTD. (60 Kagumachi, Besshocho Himeji-sh, Hyogo 25, 〒6710225, JP)
アユミ工業株式会社 (〒25 兵庫県姫路市別所町家具町６０番地 Hyogo, 〒6710225, JP)
アユミ工業株式会社 (〒25 兵庫県姫路市別所町家具町６０番地 Hyogo, 〒6710225, JP)
International Classes:
B23K1/008; B23K1/00; B23K3/00; B23K3/04; B23K31/02; H01L21/60; H05B3/14; H05K3/34; B23K101/40; B23K101/42
Attorney, Agent or Firm:
HATTA & ASSOCIATES (Dia Palace Nibancho, 11-9 Nibancho, Chiyoda-k, Tokyo 84, 〒1020084, JP)
Previous Patent: METAL GASKET AND METHOD FOR PRODUCING DIE FOR METAL GASKET
Next Patent: GAS JET DEVICE
Next Patent: GAS JET DEVICE