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Title:
HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD AND METHOD FOR MANUFACTURING HEATSINK-INTEGRATED INSULATING CIRCUIT BOARD
Document Type and Number:
WIPO Patent Application WO/2022/114068
Kind Code:
A1
Abstract:
The present invention comprises: a heatsink (20) having a heat-dissipating fin (22); an insulating resin layer (12) formed on a top plate portion (21) of the heatsink (20); and a circuit layer (13) provided on one surface of the insulating resin layer (12). An angle θ formed by an end of a metal piece (33) and the surface of the insulating resin layer (12) is 70° to 110° inclusive. Root-mean-square heights Sq1, Rq1 of the top plate portion (21) of the heatsink (20) and a joint surface of the metal piece (33) with respect to the insulating resin layer (12), and root-mean-square heights Sq2, Rq1 of the top plate portion (21) of the heatsink (20) and a region of the metal piece (33) other than the joint surface with respect to the insulating resin layer (12) satisfy the relationship Sq1 > Sq2 or Rq1 > Rq2.

Inventors:
SAKANIWA YOSHIAKI (JP)
OHASHI TOYO (JP)
SAKAMAKI MARINA (JP)
KUBOTA KENJI (JP)
Application Number:
PCT/JP2021/043225
Publication Date:
June 02, 2022
Filing Date:
November 25, 2021
Export Citation:
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Assignee:
MITSUBISHI MATERIALS CORP (JP)
International Classes:
H01L23/36
Domestic Patent References:
WO2018180965A12018-10-04
WO1998023137A11998-05-28
Foreign References:
JP2018101768A2018-06-28
JP2018062704A2018-04-19
JP2020163650A2020-10-08
JP2013093540A2013-05-16
JP2015220341A2015-12-07
JP2001057406A2001-02-27
JPS6450592A1989-02-27
JP2020195064A2020-12-03
JP2015207666A2015-11-19
JPH09135057A1997-05-20
Attorney, Agent or Firm:
MATSUNUMA Yasushi et al. (JP)
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