Title:
HEATSINK UNIT, IC SOCKET, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, AND SEMICONDUCTOR PACKAGE
Document Type and Number:
WIPO Patent Application WO/2022/091735
Kind Code:
A1
Abstract:
The present invention provides a heatsink unit that does not break or damage an IC package and has a small mounting area and high heat dissipating efficiency. The heatsink unit 1 is provided with a base portion 22, a heatsink 2, a unit base 4, a heatsink pedestal 5, a frame body 6, a first lever 8, and a second lever 7. As the frame body 6 reaches a confronting position, any further pivotal movement is regulated, the heatsink pedestal 5 supported on the frame body 6 moves down, and an end face of the heatsink 2 supported on the heatsink pedestal 5 contacts the IC package.
Inventors:
MIWA KOUICHI (JP)
SAGANO HIDEKI (JP)
SATO MASARU (JP)
SAGANO HIDEKI (JP)
SATO MASARU (JP)
Application Number:
PCT/JP2021/037115
Publication Date:
May 05, 2022
Filing Date:
October 07, 2021
Export Citation:
Assignee:
YAMAICHI ELECTRONICS CO LTD (JP)
International Classes:
H01L23/32; G01R31/26; H01L23/40; H01R33/76
Domestic Patent References:
| WO2015098947A1 | 2015-07-02 |
Foreign References:
| JP2008010563A | 2008-01-17 | |||
| JP2003123926A | 2003-04-25 | |||
| JP2020174016A | 2020-10-22 | |||
| JP2010073515A | 2010-04-02 | |||
| JP2003059606A | 2003-02-28 | |||
| JP2008014655A | 2008-01-24 | |||
| US6086387A | 2000-07-11 |
Attorney, Agent or Firm:
TRY INTERNATIONAL IP LAW FIRM (JP)
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