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Patent Searching and Data


Title:
HEATSINK
Document Type and Number:
WIPO Patent Application WO/2019/189726
Kind Code:
A1
Abstract:
The purpose of the present invention is to provide a heatsink with which it is possible to obtain excellent cooling performance, prevent an increase in ventilation resistance of cooling air, and reduce pressure loss. The heatsink is provided with heat-dissipating fins extending in a vertical direction from a heat-receiving portion. The heat-dissipating fins, as viewed from a major surface side, include a cutout portion in which a distal end-side corner portion of the heat-dissipating fins is receded inward in a major surface direction of the heat-dissipating fins from a virtual rectangle or a virtual square formed by: a side on the heat-receiving portion side of the heat-dissipating fins; first sides extending from both ends of the side on the heat-receiving portion in a direction orthogonal to the side on the heat-receiving portion side; and a second side formed by extension, to the first sides, of a linear portion of a side on the distal end side of the heat-dissipating fins opposing the side on the heat-receiving portion side.

Inventors:
WATANABE Masato (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
MEGURO Masahiro (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
SAKAI Hiroshi (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
UCHIMURA Yasuhiro (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
HIKICHI Syuuta (2-3, Marunouchi 2-chome, Chiyoda-k, Tokyo 22, 〒1008322, JP)
Application Number:
JP2019/013928
Publication Date:
October 03, 2019
Filing Date:
March 29, 2019
Export Citation:
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Assignee:
FURUKAWA ELECTRIC CO., LTD. (2-3 Marunouchi 2-chome, Chiyoda-ku Tokyo, 22, 〒1008322, JP)
International Classes:
H01L23/36; H01L23/427; H01L23/467; H05K7/20
Domestic Patent References:
WO2010109799A12010-09-30
Foreign References:
JP2007073816A2007-03-22
JP2016181547A2016-10-13
US20110315365A12011-12-29
Attorney, Agent or Firm:
EINSEL Felix-Reinhard et al. (Sonderhoff & Einsel Law and Patent Office, Shin-Marunouchi Center Building 6-2, Marunouchi 1-chome, Chiyoda-k, Tokyo 05, 〒1000005, JP)
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