Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HELICAL COMPRESSION SPRING AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2018/190331
Kind Code:
A1
Abstract:
Provided is a helical compression spring with high durability and high settling resistance obtained by forming a C-enriched layer having a very thin and even thickness on a wire surface, so as to provide a residual compressive stress distribution suitable for a molded wire. The helical compression spring is made of a steel wire that comprises, by wt%, 0.5%-0.7% of C, 1.2%-3.0% of Si, 0.3%-1.2% of Mn, 0.5%-1.9% of Cr, and 0.05%-0.5% of V, optionally at least one or two of 1.5% or less of Ni, 1.5% or less of Mo, and 0.5% or less of W, and the balance iron and inevitable impurities. The helical compression spring has, on the surface layer thereof, a C-enriched layer having a carbon concentration that exceeds the average concentration of C contained in the steel wire, and the thickness of the C-enriched layer is set to be within the range of 0.01-0.05 mm over the entire circumference of the steel wire.

Inventors:
AKANUMA TOSHIYUKI (JP)
SHIRAISHI TOHRU (JP)
IWAGAKI YOHEI (JP)
TAKAHASHI KEITA (JP)
HIRAI SHUN (JP)
Application Number:
PCT/JP2018/015034
Publication Date:
October 18, 2018
Filing Date:
April 10, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
NHK SPRING CO LTD (JP)
International Classes:
C22C38/00; C21D1/06; C21D7/06; C21D9/02; C22C38/46; F16F1/06; C22C38/54
Domestic Patent References:
WO2014042066A12014-03-20
Foreign References:
JP2014206219A2014-10-30
JP2009052144A2009-03-12
JPH10305342A1998-11-17
JP2004323912A2004-11-18
JPS595901B21984-02-07
JP2014055343A2014-03-27
JP2009226523A2009-10-08
Other References:
See also references of EP 3611286A4
Attorney, Agent or Firm:
SUENARI, Mikio (JP)
Download PDF: