Title:
HIDE-PUNCHING DEVICE, HIDE-PUNCHING METHOD AND HIDE SHEET
Document Type and Number:
WIPO Patent Application WO/2013/069600
Kind Code:
A1
Abstract:
This hide-punching device (1) comprises a receiving mold (21) in which receiving holes (22) are formed, a pressing mold (31) in which stowing holes (32) that communicate with the receiving holes (22) when united with the receiving mold (21) are formed, and a moving member (45) provided with punching pins (5) that are stowed in the stowing holes (32) of the pressing mold (31). The hide-punching device is provided with pressing projections (35) around the stowing holes (32) of the pressing mold (31). A hide (3) is disposed between the receiving mold (21) and the pressing mold (31), and the pressing projections (35) of the pressing mold (31) are placed in contact with the hide (3). By moving the moving member (45) to one side, the punching pins (5) protrude from the pressing projections (35) and form punch holes (9) in the hide (3).
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Inventors:
MATSUMURA KENSAKU (JP)
Application Number:
PCT/JP2012/078596
Publication Date:
May 16, 2013
Filing Date:
November 05, 2012
Export Citation:
Assignee:
MIDORI HOKUYO CO LTD (JP)
International Classes:
C14B5/00; B26F1/00; B26F1/02; B26F1/14
Foreign References:
| JP2004197015A | 2004-07-15 | |||
| JP2010115718A | 2010-05-27 | |||
| JP2004162248A | 2004-06-10 | |||
| JPH11209800A | 1999-08-03 | |||
| JPS6377511U | 1988-05-23 | |||
| JPH0413298U | 1992-02-03 |
Attorney, Agent or Firm:
TAKADA, SHUJI (JP)
Shuji Takada (JP)
Shuji Takada (JP)
Download PDF:
Claims:
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