Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
Document Type and Number:
WIPO Patent Application WO/2013/126308
Kind Code:
A8
Abstract:
A method for fabricating an electric coil on a circuit board comprising fabricating on the circuit board a first coil layer comprising a coil trace and a plurality of vias distributed along the length of the coil trace, and overlaying a second coil layer on the first coil layer, wherein the vias of the first coil layer join the first coil layer and the second coil layer..

Inventors:
ZABACO, Jorge (12813 Starwood Lane, San Diego, CA, 92131, US)
Application Number:
US2013/026601
Publication Date:
January 22, 2015
Filing Date:
February 18, 2013
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building Bantian, Longgang DistrictShenzhen, Guangdong 9, 518129, CN)
FUTUREWEI TECHNOLOGIES, INC. (5340 Legacy Drive, Suite 175Plano, Texas, 75024, US)
International Classes:
H01F17/00
Attorney, Agent or Firm:
CONLEY, Rose, P.C. (5601 Granite Parkway, Suite 750Plano, Texas, 75024, US)
Download PDF: