Title:
HIGH-DENSITY 3D STACKED FAN-OUT PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2024/007440
Kind Code:
A1
Abstract:
The present application discloses a high-density 3D stacked fan-out packaging structure and a manufacturing method therefor. The packaging structure comprises a plurality of active devices, a plurality of high-density interconnect modules and a plurality of passive chips. The active devices and the passive chips realize 3D interconnection in the vertical direction by means of the high-density interconnect modules. In the present application, main recesses for embedding main chips and auxiliary recesses having a smaller size beside the main recesses can be etched in one step, so that two-time etching is avoided, particularly, the risks during etching of through holes when a bonding structure is brought into an etching machine are avoided, and the product production cycle is greatly shortened. The high-density interconnect modules are independently made from a same substrate, the high-density through holes are formed according to design requirements, the design requirement for higher I/O density is met, the yield of the through hole part in a reconstituted wafer is guaranteed, moreover, a compact and stable blocking layer can be formed on the side wall of each through hole under a high-temperature condition, and the situation that a temporary bonding material is not resistant to high temperature does not need to be considered.
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Inventors:
XIAO ZHIYI (CN)
MA SHUYING (CN)
LIU SU (CN)
MA SHUYING (CN)
LIU SU (CN)
Application Number:
PCT/CN2022/116559
Publication Date:
January 11, 2024
Filing Date:
September 01, 2022
Export Citation:
Assignee:
HUATIAN TECH KUNSHAN ELECT CO LTD (CN)
International Classes:
H01L25/16; H01L21/50; H01L21/56; H01L21/768; H01L23/48
Foreign References:
| CN113725153A | 2021-11-30 | |||
| CN105575913A | 2016-05-11 | |||
| CN107634049A | 2018-01-26 | |||
| US20210123729A1 | 2021-04-29 |
Attorney, Agent or Firm:
BEIJING BRIGHT IP AGENCY CO., LTD. (CN)
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