Title:
HIGH DENSITY INTERCONNECTION USING FANOUT INTERPOSER CHIPLET
Document Type and Number:
WIPO Patent Application WO/2018/226394
Kind Code:
A3
Abstract:
Multiple component package structures are described in which an interposer chiplet (110) is integrated to provide fine routing between components. In an embodiment, the interposer chiplet (110) and a plurality of conductive vias (142) are encapsulated in an encapsulation layer (140). A first plurality of terminals (135A) of the first (130) and second (132) components may be in electrical connection with the plurality of conductive pillars and a second plurality of terminals (135B) of first and second components may be in electrical connection with the interposer chiplet (110).
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Inventors:
ZHAI JUN (US)
ZHONG CHONGHUA (US)
HU KUNZHONG (US)
ZHONG CHONGHUA (US)
HU KUNZHONG (US)
Application Number:
PCT/US2018/033813
Publication Date:
March 21, 2019
Filing Date:
May 22, 2018
Export Citation:
Assignee:
APPLE INC (US)
International Classes:
H01L21/60; H01L21/48; H01L21/683; H01L21/98; H01L23/16; H01L23/498; H01L23/538; H01L25/065; H01L25/10; H01L25/18
Domestic Patent References:
| WO2017078709A1 | 2017-05-11 |
Foreign References:
| US9368450B1 | 2016-06-14 | |||
| KR20150120177A | 2015-10-27 | |||
| US20110285006A1 | 2011-11-24 | |||
| US20030215993A1 | 2003-11-20 | |||
| US20160141234A1 | 2016-05-19 | |||
| US20130292846A1 | 2013-11-07 | |||
| JP2016213370A | 2016-12-15 | |||
| US20170084555A1 | 2017-03-23 | |||
| US20170062383A1 | 2017-03-02 | |||
| US20120049353A1 | 2012-03-01 |
Attorney, Agent or Firm:
AIKIN, Jacob (US)
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