Title:
HIGH DIAMOND FRAME STRENGTH PCD MATERIALS
Document Type and Number:
WIPO Patent Application WO/2012/145351
Kind Code:
A3
Abstract:
The present disclosure relates to cutting elements incorporating polycrystalline diamond bodies used for subterranean drilling applications, and more particularly, to polycrystalline diamond bodies having high diamond frame strength and methods for forming and evaluating such polycrystalline diamond bodies. A polycrystalline diamond body is provided, having a top surface, a cutting edge meeting the top surface, and a first region including at least a portion of the cutting edge. The first portion exhibits a diamond frame strength of about 1200 MPa or greater, or about 1300 MPa or greater.
Inventors:
YU FENG (US)
BELNAP J DANIEL (US)
BELNAP J DANIEL (US)
Application Number:
PCT/US2012/034002
Publication Date:
May 02, 2013
Filing Date:
April 18, 2012
Export Citation:
Assignee:
SMITH INTERNATIONAL (US)
YU FENG (US)
BELNAP J DANIEL (US)
YU FENG (US)
BELNAP J DANIEL (US)
International Classes:
E21B10/46; C09K3/14; C22C26/00
Foreign References:
| US20100294571A1 | 2010-11-25 | |||
| US20100122853A1 | 2010-05-20 | |||
| US20110024201A1 | 2011-02-03 |
Attorney, Agent or Firm:
HOLTHUS, Lisa K. (IP Administration Center of ExcellenceRoom 472, Houston Texas, US)
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