Title:
HIGH DURABILITY THERMALLY CONDUCTIVE COMPOSITE AND LOW PUMP-OUT GREASE
Document Type and Number:
WIPO Patent Application WO/2012/067247
Kind Code:
A1
Abstract:
Provided is a high durability thermally conductive composite containing 0.5-10 volume% of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25°C of 10000-15000 Pa-s, 1-10 volume% of an alkylalkoxysilane, and 40-65 volume% of an inorganic filler with the remainder being an addition-reacting low molecular weight silicone with viscosity at 25°C of 0.2-0.5 Pa-s. Also provided is a grease characterized in containing 38-48 volume% of an addition-reacting low molecular weight silicone with viscosity at 25°C of 0.2-0.5 Pa-s, 2-8 volume% of a high molecular weight silicone with vinyl groups on both ends with viscosity at 25°C of 10000-15000 Pa-s, and 50-60 volume% of an inorganic filler. It is preferable that the alkylalkoxysilane is a triethoxysilane or trimethoxysilane wherein the number of carbons in the alkyl groups is six to ten.
Inventors:
DOHMOTO TAKASHI (JP)
OSHIMA KAZUHIRO (JP)
YAMAGATA TOSHITAKA (JP)
OSHIMA KAZUHIRO (JP)
YAMAGATA TOSHITAKA (JP)
Application Number:
PCT/JP2011/076724
Publication Date:
May 24, 2012
Filing Date:
November 18, 2011
Export Citation:
Assignee:
DENKI KAGAKU KOGYO KK (JP)
DOHMOTO TAKASHI (JP)
OSHIMA KAZUHIRO (JP)
YAMAGATA TOSHITAKA (JP)
DOHMOTO TAKASHI (JP)
OSHIMA KAZUHIRO (JP)
YAMAGATA TOSHITAKA (JP)
International Classes:
C10M107/50; C10M113/06; C10M119/04; C10M125/10; C10M125/20; C10M169/02; C10N10/04; C10N10/06; C10N20/00; C10N20/02; C10N20/06; C10N50/10
Domestic Patent References:
| WO2008047809A1 | 2008-04-24 |
Foreign References:
| JP2008184549A | 2008-08-14 | |||
| JPH04268376A | 1992-09-24 | |||
| JP2010126568A | 2010-06-10 | |||
| JP2006169343A | 2006-06-29 | |||
| JP2009185212A | 2009-08-20 | |||
| JP2004307643A | 2004-11-04 | |||
| JP2003301189A | 2003-10-21 | |||
| JP2005170971A | 2005-06-30 |
Attorney, Agent or Firm:
Takahashi, Hayashi and Partner Patent Attorneys, Inc. (JP)
Patent business corporation Takahashi and wood and partners (JP)
Patent business corporation Takahashi and wood and partners (JP)
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Claims:
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