Field

[001] This application provides a high-efficiency thermal management system usable for on-board charging of an electrical vehicle.

Background

[002] Electrical vehicles (EVs) rely on battery energy storage which can be charged by plugging an EV into an electrical grid. When an EV is plugged into an electrical grid, an EV on-board charger manages the flow of power between the electrical grid and the battery. Among other functions, a charger can rectify an electrical grid’s alternating current (AC) to the direct current (DC) used by the battery.

[003] An on-board charger typically includes components such as MOSFETs as well as magnetic components. During operation, an on-board charger can generate considerable waste heat which must be shunted away. On-board chargers can be cooled by both passive and active cooling systems.

[004] The description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this section, as well as aspects of the description that cannot otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

SUMMARY

[005] Thermal management of on-board chargers has becoming increasingly important as demands have increased for improved EV range and performance. On-board chargers can be cooled by both passive and active cooling systems, with active cooling systems in particular posing further challenges including, for example, maintaining fluid pressure throughout the cooling system

[006] Enhanced heat management can be accomplished by increasing the surface area for heat exchange and reducing pressure loss as cooling fluid is circulated in the system. [007] A system for thermal management of a temperature-sensitive device can comprise: a housing comprising thermally conductive material; the housing further comprising two integrally formed channels for circulating a thermal transfer fluid; at least one component of the temperature-sensitive device comprising at least four sides, wherein the component is mounted to the housing; and wherein the two channels are adjacent to the component on at least three of the four sides.

[008] A system for thermal management can include two channels comprising a first channel and a second channel, wherein the first channel generally circumscribes the second channel, and wherein the length of the first channel is generally parallel to the length of the second channel.

[009] A system for thermal management can include two channels comprising a first channel generally surrounding a second channel; wherein the first channel is longer, wider, and deeper than the second channel, and wherein the second channel is partially bisected by a divider.

[010] A system for thermal management can include a first channel at least partially separated from a second channel by a potting material, and wherein the depth of the first channel exposes the first channel to more potting material than the second channel.

[011] A system for thermal management can include a first channel at least partially separated from a second channel by a potting material.

[012] A system for thermal management can include two channels comprising a first and a second channel; and wherein at least a portion of the housing is raised to accommodate the first channel, the lateral sides of the raised housing forming a cooling wall; and wherein the second channel abuts the housing forming a cooling floor.

[013] A system for thermal management can include a cover coupled to a housing to fluidly isolate two channels against the housing.

[014] A system for thermal management can include potting material applied to a cooling wall, a cooling floor, or both a cooling wall and a cooling floor, as well as to at least one component.

[015] A system for thermal management can include a phase-change thermal interface material is applied to a cooling wall, a cooling floor, or both the cooling wall and the cooling floor. [016] A system for thermal management can include either a first channel, a second channel, or both a first channel and a second channel are at least partially lined with a potting material.

[017] A system for thermal management can include a first channel forming a first flow path for a thermal transfer fluid, wherein the first channel comprises a first controlled orifice and a second controlled orifice, and wherein a second channel forms a second flow path for the thermal transfer fluid, wherein the second channel is configured to receive the thermal transfer fluid from the first flow path through the first controlled orifice, and wherein the second channel is configured to return the thermal transfer fluid from the second flow path to the first flow path through the second controlled orifice.

[018] A system for thermal management can include a second channel partially bisected by a partition to divide the second flow path into first and second bypass channels

[019] A system for thermal management can include a first controlled orifice configured to provide a back pressure to a first flow path wherein a second channel is configured to supply a bypass fluid pressure for a thermal transfer fluid that increases a main fluid pressure of the thermal transfer fluid in a first channel.

[020] A thermal management system can include a housing comprising a heat sink manufactured from thermally conductive material; a thermal exchange volume defined by a first channel and a second channel; wherein the thermal exchange volume is integrated into the housing; wherein at least one thermally- sensitive component is secured to the housing; and wherein the thermal exchange volume is thermally coupled to the at least one component via the housing.

[021] A thermal management system can include a first channel and a second channel, both U-shaped; wherein the first channel is longer, wider, and deeper than the second channel; wherein the first channel substantially encompasses the second channel; and wherein the length of the first channel is substantially parallel to the length of the second channel.

[022] A thermal management system can include a second channel at least partially bisected by a partition.

[023] A thermal management system can include a first channel at least partially separated from the second channel by a potting material. [024] A thermal management system can include at least a portion of a housing raised to accommodate a first channel, comprising a cooling wall.

[025] A thermal management system can include a phase-change thermal interface material applied between a housing and at least one component.

[026] A thermal management system can include at least a portion of a housing incorporating a second channel, and wherein a housing comprises a cooling floor.

[027] A thermal management system can include a plurality of components mounted to a cooling floor and are generally circumscribed by a cooling wall.

[028] A thermal management system can include a cover coupled to a housing.

[029] A thermal management system can include either a first channel, a second channel, or both the first channel and the second channel are at least partially lined with a potting material.

[030] A thermal management system can include a potting material applied to a cooling wall, a cooling floor, or both the cooling wall and the cooling floor, as well as to at least one component.

[031] A thermal exchange device can comprise a first channel and a second channel; wherein the first and second channels are substantially U-shaped; wherein the first channel generally surrounds the second channel; and wherein the first channel is of greater length, width, and depth than the second channel.

[032] A thermal exchange device can comprise a first channel and a second channel formed integrally into a housing comprising thermally conductive material.

[033] A thermal exchange device can comprise a second channel at least partially bisected by a partition.

[034] A thermal exchange device can comprise a first channel generally parallel, along the first channel’s length, to the length of a second channel.

[035] A thermal exchange device can comprise a first channel and a second channel partially separated by potting material.

[036] A thermal exchange device can comprise at least a portion of a housing raised to accommodate a first channel, the lateral sides of the raised housing forming a cooling wall. [037] A thermal exchange device can comprise a second channel abutting a portion of a housing forming a cooling floor.

[038] A thermal exchange device can comprise a housing further comprising phase-change thermal interface material.

[039] A thermal exchange device can comprise a housing further comprising potting material.

[040] A thermal exchange device can comprise at least one thermally- sensitive component mounted to a housing.

[041] A thermal exchange device can comprise phase-change thermal interface material located between a housing and at least one component.

[042] A thermal exchange device can comprise either a first channel, a second channel, or both a first channel and a second channel at least partially lined with a potting material.

[043] An on-board charging device can comprise a thermal exchange device.

[044] Additional objects and advantages will be set forth in part in the description which follows, and in part will be obvious from the description, or can be learned by practice of the disclosure. The objects and advantages will also be realized and attained by means of the elements and combinations particularly pointed out in the appended claims.

BRIEF DESCRIPTION OF THE DRAWINGS

[045] Figure 1 is a perspective view of an example of a thermal exchange device, with an inset perspective view showing a portion of the device in detail.

[046] Figure 2 is a dorsal, perspective view of a thermal management system.

[047] Figure 3 is a dorsal, overhead view of a thermal management system.

[048] Figure 4 is a ventral, perspective view of a thermal management system with an inset perspective view of a cover, not to scale.

[049] Figure 5 is a ventral, perspective view of a thermal management system.

[050] Figure 6 is a ventral, overhead view of a thermal management system.

[051] Figure 7 is a ventral, cutaway perspective view of a thermal management system [052] Figure 8 is a cross-section of a thermal management system.

DETAILED DESCRIPTION

[053] Reference will now be made in detail to the examples which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts. Directional references such as “ventral,” “dorsal,” “left,” and “right” are for ease of reference to the figures.

[054] FIG. 1 includes a perspective view of the approximate shape defined by a thermal exchange device, including primary coolant channel 101 and secondary coolant channel 102. Primary coolant channel 101 and secondary coolant channel 102 are coupled to at least two connectors 103, at least one of which is an inlet connector and at least one of which is an outlet connector. In this disclosure, the primary coolant channel 101 is also called a main or first channel, and the secondary coolant channel 102 is also called a second channel that can comprise a first bypass channel and a second bypass channel.

[055] As seen in FIG. 1 , the primary coolant channel 101 defines a generally U-shaped volume and is deeper than the secondary coolant channel 102. The secondary coolant channel 102 defines a partially bisected U-shape of less length L2, depth D2, and optionally width W2 than the length L1 , depth D1 , and optionally width W1 of the primary coolant channel 101. Controlling the fluid in the primary coolant channel 101 versus the fluid in the secondary coolant channel 102 controls a pressure in each of the primary and secondary coolant channels according to fluid flow laws. This is because the primary coolant channel 101 comprises a first controlled orifice 104 that supplies fluid to the secondary coolant channel 102. Bleeding fluid pressure from the primary coolant channel 101 to the secondary coolant channel 102 creates a back pressure in the primary coolant channel 101 . Fluid bled to the secondary coolant channel 102 flows through first and optionally second bypass flow paths to exit the secondary coolant channel 102 through second controlled orifice 105. The fluid exits secondary coolant channel 102 and joins fluid in primary coolant channel 101 before exiting the thermal exchange device. The bisection of the secondary coolant channel 102 can be lengthened, shortened, enlarged, reduced, removed altogether, or otherwise modified to adjust thermal transfer characteristics. In the illustrated instance, the secondary coolant channel 102 controls pressure characteristics of the primary coolant channel 101 such that flow rate and pressure does not drop, thus maintaining an optimal thermal environment for components 201 mounted to the thermal management device as described in further detail below.

[056] The length of secondary coolant channel 102 can be - but is not required to be - generally parallel to the length of primary coolant channel 101 . Further, secondary coolant channel 102 can be generally bounded by primary coolant channel 101 . However, the specific volumetric shapes adopted by primary coolant channel 101 and secondary coolant channel 102 can vary depending on design parameters and thermal management requirements. The secondary coolant channel 102 can be implemented as a bypass channel to the primary coolant channel 101 since the thermal transfer fluid supplied to the secondary coolant channel 102 bypasses the main fluid flow path of the primary coolant channel 101.

[057] Connectors 103 facilitate connection between the primary coolant channel 101 and the secondary coolant channel 102, to a pump or fan assembly (not pictured), as well as, perhaps, accompanying tubing or piping, which circulates a thermal transfer fluid through the primary coolant channel 101 and the secondary coolant channel 102. Thermal transfer fluid can be, for example, water, air, a glycol solution, or another thermal management fluid. At least one connector 103 can be a fluid intake and at least one connector 103 can be a fluid outlet. Note that the location of first controlled orifice 104 and second controlled orifice 105 can be swapped, or otherwise differ, depending on which connector 103 is an intake and which connector 103 is an outlet.

[058] FIG. 2 presents a dorsal, perspective view of a thermal management system integrating a thermal exchange device in a housing 200. “Dorsal” is used for convenience in reference to the drawings as a term of perspective as the thermal management system can operate in any orientation. As seen in FIG. 2, a thermal management system includes a housing 200. Housing 200 provides a floor 210 for mounting components 201. In this working example, components 201 are exemplary pieces of an EV on-board charger including magnetic elements and MOSFETS. Components 201 can be sensitive to temperature. Alternatives like IGBTs or the like can be substituted, and PCBs can also be mounted. [059] Components 201 can be mounted to the housing 200 by a combination of fasteners and/or thermally conductive potting compound. Phasechange thermal interface material can also be applied between housing 200 and components 201 to aid in thermal exchange. A layer of thermal interface material, for example, can be applied to floor 210, as by lamination, coating, adhesion, or the like. Housing 200 can act as a heat sink, and can be constructed by die casting thermally conductive metallic materials among other options. Materials such as aluminum, steel, or other metallic materials, can be used to enable housing 200 to conduct and transfer thermal energy between the components 201 and the thermal exchange device.

[060] Housing 200 integrates a primary coolant channel 401 to form cooling wall 204. Cooling wall 204 is generally U-shaped in this embodiment but can adopt other configurations. Placement of components 201 proximate to cooling wall 204 facilitates thermal management of those components 201. Cooling wall 204 can protrude more prominently or less prominently from the dorsal floor of housing 200 as thermal management needs require. Moreover, the profile of the cooling wall 204 can differ from that of the flat, vertical surfaces shown in FIG. 2. Potting material and phase-change thermal interface material can be applied to cooling wall 204 and the floor 210 of the housing 200 to further secure components 201 and augment thermal management capability.

[061] The ability of the system to thermally manage components 201 can decrease as distance from cooling wall 204 increases. Therefore, less thermally sensitive components 201 can be placed further away from cooling wall 204 while more sensitive components 201 can be placed closer to cooling wall 204.

[062] Housing 200 can comprise a mounting point 203, but can also include a plurality of mounting points 203, which can secure the housing 200 to a superstructure or, alternatively, to secure other items to housing 200. Fastener holes are shown, but numerous alternatives exist in the art, such as stakes, cleats, welds, among others. Housing 200 further incorporates ports 205, with at least one inlet port and at least one outlet port. Ports 205 allow for the entry and egress of a thermal transfer fluid into the thermal exchange device. Thermal transfer fluid can be pumped to the inlet port at a first pressure. It is desired that the thermal transfer fluid exit the outlet port at the same pressure, so the first and second controlled orifices 104, 105 are placed in the housing 200 to bleed thermal transfer fluid from the primary coolant channel 101 into the secondary coolant channel 102. The volume of the secondary coolant channel 102 is also chosen relative to the primary coolant channel 101 to avoid a pressure drop from inlet port to outlet port. Housing 200 can also comprise other apertures 206 to allow, for example, wiring or cables to pass through. Risers 207 and depressions 208 can also be integrally formed from housing 200 or incorporated with housing 200 to accommodate components 201 as needed. Housing 200 can also incorporate surface features 209 to aid in operation of components 201.

[063] FIG. 3 presents a dorsal, overhead view of a thermal management system. FIG 3. shows housing 200 with components 201 removed, revealing cooling floor 301 surrounded by cooling wall 204. From this perspective, cooling wall 204 appears generally U-shaped though cooling wall 204 can adopt other configurations. Cooling floor 301 is a portion of floor 210 that is diametrically opposite, and thermally coupled via housing 200 to, bypass coolant channel 402. Cooling floor 301 can include dividers 302 to facilitate placement of, and/or provide structural support to, components 201 . Potting material may be applied to cooling wall 204 and/or cooling floor 301 . A layer of thermal interface material, for example, can be applied to cooling wall 204 and/or cooling floor 301 , as by lamination, coating, adhesion, or the like. Dividers 302 can be formed integrally with housing 200, or formed separately and incorporated on housing 200.

[064] FIG. 4 presents a ventral, perspective view of a thermal management system integrating a thermal exchange device. “Ventral” is used as a term of convenience for perspective as the thermal management system can operate in any orientation. Housing 200 includes integrally formed main coolant channel 401 and bypass coolant channel 402 which are connected to each other and connect to at least two ports 205, at least one port of which is an inlet port and at least one port of which is an outlet port through which a thermal transfer fluid can travel when propelled by a pump or some other motivating device (not pictured). Main coolant channel 401 is die cast into housing 200 to form cooling walls 204 on the dorsal side of housing 200. Contrasted with main coolant channel 401 , bypass channel 402 is comparatively shallow and, through thermal coupling with housing 200, bypass channel 402 forms cooling floor 301 on the dorsal side of housing 200. [065] The main coolant channel 401 defines a generally U-shaped space. The bypass coolant channel 402 defines a similar but partially divided U-shaped space that is comparatively shorter, narrower, and shallower. Bypass divider 403, which creates the division in bypass coolant channel 402, can be lengthened, shorted, enlarged, reduced, removed, or otherwise modified to adjust the flow rate of the thermal transfer fluid, and to otherwise accommodate thermal management parameters. The main coolant channel 401 and bypass coolant channel 402 are generally parallel, though the main coolant channel 401 largely circumscribes bypass coolant channel 402 on three of the four sides of the bypass coolant channel 402. Note that the general forms of main coolant channel 401 and bypass coolant channel 402 as described herein and as shown in the figures can vary as thermal design requirements dictate. Either main coolant channel 401 , bypass coolant channel 402, or both main coolant channel 401 and bypass coolant channel 402 may be partially filled and/or lined with potting material.

[066] Housing 200 further defines an interface 404. Interface 404 generally lies along the outer perimeter of main coolant channel 401 and allows housing 200 to couple with cover 405. Interface 404 may be an outline, or a rim, along the outer perimeter of main coolant channel 401 . Cover 405 can be flared on at least one end as shown in FIG. 4 to assist in placement and assembly. Cover 405 is generally composed of at least one piece of material which, when joined to housing 200 at interface 404, seals main coolant channel 401 and bypass coolant channel 402 such that thermal transfer fluid cannot leak or otherwise escape from between housing 200 and cover 405. Cover 405 can be joined to housing 200 at interface 404 by welding, such as friction stir welding, or some other joining means.

[067] Channel divider 406 separates main coolant channel 401 (also called primary coolant channel 101 ) from bypass coolant channel 402 (also called secondary coolant channel 102). Channel divider 406 can be integrally formed with housing 200 during a casting or molding process or channel divider 406 can be a separate part combined with housing 200 and welded in place to seal and fluidly separate the main and bypass coolant channels. As an option, channel divider 406 can be hollowed so as to internally form a crevice into which potting material can ingress. Similarly, bypass divider 403 can be hollowed on the side opposite the fluid handling side so that potting material can ingress into a crevice of the bypass divider 403.

[068] FIG. 5, a ventral, perspective view of a thermal management system with an integrated thermal exchange device shows the joined assembly of housing 200 and cover 405.

[069] As seen in FIGS. 4 and 5, the ventral aspect of housing 200 can further comprise mounting points 203, ports 205, other apertures 206, risers 207, depressions 208, and surface features 209. As on the dorsal side of housing 200, components 201 can also be mounted on the ventral side of housing 200. The operating parameters of components 201 can require components 201 to be maintained with a specified range of temperatures.

[070] FIG. 6 shows an overhead ventral perspective of a thermal management system. Main channel dividers 601 can optionally be included to assist in regulating the flow of thermal transfer fluid. Main channel dividers 601 can be added, enlarged, reduced, or removed altogether to adjust the thermal transfer characteristics of housing 200, adjust the flow characteristics of the thermal transfer fluid, or to address other design concerns.

[071] FIG. 7 shows a ventral cutaway perspective view of a thermal management system. As seen in FIG. 7, main coolant channel 401 and cooling wall 204 substantially surrounds components 201 to facilitate thermal transfer between components 201 and the thermal transfer fluid flowing through main coolant channel 401.

[072] FIG. 8 shows a frontal cross-section of a thermal management system. In FIG. 8, cooling wall 204 is adjacent to components 201 on two sides, with a cooling floor 301 adjacent to components 201 on a third side. Further, cooling wall 204 is adjacent to main coolant channel 401 through which thermal transfer fluid flows. The adjacency of cooling wall 204 to main coolant channel 401 facilitates the transfer of thermal energy between components 201 and the thermal transfer fluid. Similarly, cooling floor 301 is adjacent to bypass coolant channel 402, and this adjacency facilitates the transfer of thermal energy between components 201 and the thermal transfer fluid.

[073] In view of the foregoing, it can be said that a system for thermal management of a temperature-sensitive device can comprise: a housing comprising thermally conductive material; the housing further comprising two integrally formed channels for circulating a thermal transfer fluid; at least one component of the temperature-sensitive device comprising at least four sides, wherein the component is mounted to the housing; and wherein the two channels are adjacent to the component on at least three of the four sides.

[074] A system for thermal management can include two channels comprising a first channel and a second channel, wherein the first channel generally circumscribes the second channel, and wherein the length of the first channel is generally parallel to the length of the second channel.

[075] A system for thermal management can include two channels comprising a first channel generally surrounding a second channel; wherein the first channel is longer, wider, and deeper than the second channel, and wherein the second channel is partially bisected by a divider.

[076] A system for thermal management can include a first channel at least partially separated from a second channel by a potting material, and wherein the depth of the first channel exposes the first channel to more potting material than the second channel.

[077] A system for thermal management can include a first channel at least partially separated from a second channel by a potting material.

[078] A system for thermal management can include two channels comprising a first and a second channel; and wherein at least a portion of the housing is raised to accommodate the first channel, the lateral sides of the raised housing forming a cooling wall; and wherein the second channel abuts the housing forming a cooling floor.

[079] A system for thermal management can include a cover coupled to a housing to fluidly isolate two channels against the housing.

[080] A system for thermal management can include potting material applied to a cooling wall, a cooling floor, or both a cooling wall and a cooling floor, as well as to at least one component.

[081] A system for thermal management can include a phase-change thermal interface material is applied to a cooling wall, a cooling floor, or both the cooling wall and the cooling floor. [082] A system for thermal management can include either a first channel, a second channel, or both a first channel and a second channel are at least partially lined with a potting material.

[083] A system for thermal management can include a first channel forming a first flow path for a thermal transfer fluid, wherein the first channel comprises a first controlled orifice and a second controlled orifice, and wherein a second channel forms a second flow path for the thermal transfer fluid, wherein the second channel is configured to receive the thermal transfer fluid from the first flow path through the first controlled orifice, and wherein the second channel is configured to return the thermal transfer fluid from the second flow path to the first flow path through the second controlled orifice.

[084] A system for thermal management can include a second channel partially bisected by a partition to divide the second flow path into first and second bypass channels

[085] A system for thermal management can include a first controlled orifice configured to provide a back pressure to a first flow path wherein a second channel is configured to supply a bypass fluid pressure for a thermal transfer fluid that increases a main fluid pressure of the thermal transfer fluid in a first channel.

[086] A thermal management system can include a housing comprising a heat sink manufactured from thermally conductive material; a thermal exchange volume defined by a first channel and a second channel; wherein the thermal exchange volume is integrated into the housing; wherein at least one thermally- sensitive component is secured to the housing; and wherein the thermal exchange volume is thermally coupled to the at least one component via the housing.

[087] A thermal management system can include a first channel and a second channel, both U-shaped; wherein the first channel is longer, wider, and deeper than the second channel; wherein the first channel substantially encompasses the second channel; and wherein the length of the first channel is substantially parallel to the length of the second channel.

[088] A thermal management system can include a second channel at least partially bisected by a partition.

[089] A thermal management system can include a first channel at least partially separated from the second channel by a potting material. [090] A thermal management system can include at least a portion of a housing raised to accommodate a first channel, comprising a cooling wall.

[091] A thermal management system can include a phase-change thermal interface material applied between a housing and at least one component.

[092] A thermal management system can include at least a portion of a housing incorporating a second channel, and wherein a housing comprises a cooling floor.

[093] A thermal management system can include a plurality of components mounted to a cooling floor and are generally circumscribed by a cooling wall.

[094] A thermal management system can include a cover coupled to a housing.

[095] A thermal management system can include either a first channel, a second channel, or both the first channel and the second channel are at least partially lined with a potting material.

[096] A thermal management system can include a potting material applied to a cooling wall, a cooling floor, or both the cooling wall and the cooling floor, as well as to at least one component.

[097] A thermal exchange device can comprise a first channel and a second channel; wherein the first and second channels are substantially U-shaped; wherein the first channel generally surrounds the second channel; and wherein the first channel is of greater length, width, and depth than the second channel.

[098] A thermal exchange device can comprise a first channel and a second channel formed integrally into a housing comprising thermally conductive material.

[099] A thermal exchange device can comprise a second channel at least partially bisected by a partition.

[0100] A thermal exchange device can comprise a first channel generally parallel, along the first channel’s length, to the length of a second channel.

[0101] A thermal exchange device can comprise a first channel and a second channel partially separated by potting material.

[0102] A thermal exchange device can comprise at least a portion of a housing raised to accommodate a first channel, the lateral sides of the raised housing forming a cooling wall. [0103] A thermal exchange device can comprise a second channel abutting a portion of a housing forming a cooling floor.

[0104] A thermal exchange device can comprise a housing further comprising phase-change thermal interface material.

[0105] A thermal exchange device can comprise a housing further comprising potting material.

[0106] A thermal exchange device can comprise at least one thermally- sensitive component mounted to a housing.

[0107] A thermal exchange device can comprise phase-change thermal interface material located between a housing and at least one component.

[0108] A thermal exchange device can comprise either a first channel, a second channel, or both a first channel and a second channel at least partially lined with a potting material.

[0109] An on-board charging device can comprise a thermal exchange device.

[0110] Other implementations will be apparent to those skilled in the art from consideration of the specification and practice of the examples disclosed herein.