Title:
HIGH ENERGY RAY-CURABLE COMPOSITION AND USE OF SAME
Document Type and Number:
WIPO Patent Application WO/2023/037941
Kind Code:
A1
Abstract:
[Problem] To provide a silicon-atom-containing high energy ray-curable composition that enables a product, which is obtained by curing the composition, to be highly regulated with respect to the mechanical properties, while having excellent workability when applied to a base material even in cases where the high composition is of solvent-free type. [Solution] A high energy ray-curable composition which is characterized by containing 5 parts by mass to 95 parts by mass of (A) a compound that has one or more (meth)acryloxy groups and no silicon atom in each molecule, and 95 parts by mass to 5 parts by mass of (B) a branched organopolysiloxane that has one or more (meth)acryloxy groups and no alkoxy group in each molecule, and which is also characterized by substantially containing no organic solvent in the composition and having a viscosity of the entire composition of 100 mPa∙s or less as determined with use of an E-type viscometer at 25°C; and a use of this high energy ray-curable composition.
Inventors:
OGAWA TAKUYA (JP)
HOSOKAWA TOMOKA (JP)
HOSOKAWA TOMOKA (JP)
Application Number:
PCT/JP2022/032782
Publication Date:
March 16, 2023
Filing Date:
August 31, 2022
Export Citation:
Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08F290/14; C09D4/02; C09D183/04
Domestic Patent References:
| WO2013080741A1 | 2013-06-06 | |||
| WO2011049078A1 | 2011-04-28 |
Foreign References:
| JP2019157081A | 2019-09-19 | |||
| JP2019183137A | 2019-10-24 | |||
| JP2007072374A | 2007-03-22 |
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