Title:
HIGH-ENTROPY ALLOY FOR ULTRA-LOW TEMPERATURE
Document Type and Number:
WIPO Patent Application WO/2017/164601
Kind Code:
A1
Abstract:
The present invention relates to a high-entropy alloy especially having excellent low-temperature tensile strength and elongation by means of having configured, through thermodynamic calculations, an alloy composition region having a FCC single-phase microstructure at 700°C or higher, and enabling the FCC single-phase microstructure at room temperature and at an ultra-low temperature. The high-entropy alloy, according to the present invention, comprises: Co: 3-12 at%; Cr: 3-18 at%; Fe: 3-50 at%; Mn: 3-20 at%; Ni: 17-45 at%; V: 3-12 at%; and inevitable impurities, wherein the ratio of the V content to the Ni content (V/Ni) is 0.5 or less, and the sum of the V content and the Co content is 22 at% or less.
Inventors:
LEE BYEONG-JOO (KR)
LEE SUNG-HAK (KR)
KIM HYOUNG-SEOP (KR)
NA YOUNG-SANG (KR)
HONG SUN-IG (KR)
CHOI WON-MI (KR)
JEON CHANG-WOO (KR)
JUNG SEUNG-MUN (KR)
LEE SUNG-HAK (KR)
KIM HYOUNG-SEOP (KR)
NA YOUNG-SANG (KR)
HONG SUN-IG (KR)
CHOI WON-MI (KR)
JEON CHANG-WOO (KR)
JUNG SEUNG-MUN (KR)
Application Number:
PCT/KR2017/002988
Publication Date:
September 28, 2017
Filing Date:
March 21, 2017
Export Citation:
Assignee:
POSTECH ACADEMY-INDUSTRY FOUND (KR)
International Classes:
C22C19/00; C22C1/02; C22C30/00
Foreign References:
| JP2016023352A | 2016-02-08 | |||
| KR20160014130A | 2016-02-11 | |||
| KR20090030198A | 2009-03-24 | |||
| JP2002173732A | 2002-06-21 | |||
| US20160025386A1 | 2016-01-28 |
Attorney, Agent or Firm:
IAM PATENT FIRM (KR)
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