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Patent Searching and Data


Title:
HIGH FREQUENCY AMPLIFIER, ELECTRONIC DEVICE, AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/106909
Kind Code:
A1
Abstract:
Provided is a high frequency amplifier in which a circuit board can be miniaturized to reduce costs. The high frequency amplifier is provided with: a first board having a matching unit; and a second board having a transistor and a first impedance conversion unit which are connected to each other, wherein the matching unit of the first board and the first impedance conversion unit are connected to each other via a first connection unit. Also, the high frequency amplifier is further provided with a third board having a matching unit, the second board is further provided with a second impedance conversion unit connected to a transistor, and the second impedance conversion unit and the matching unit of the third board can be connected to each other via a second connection unit.

Inventors:
KAWAMURA Takashi (4-14-1 Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
SATO Masahiro (4-14-1 Asahi-cho Atsugi-sh, Kanagawa 14, 〒2430014, JP)
Application Number:
JP2018/033733
Publication Date:
June 06, 2019
Filing Date:
September 12, 2018
Export Citation:
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Assignee:
SONY SEMICONDUCTOR SOLUTIONS CORPORATION (4-14-1 Asahi-cho, Atsugi-shi Kanagawa, 14, 〒2430014, JP)
International Classes:
H03F3/24; H03F3/60
Attorney, Agent or Firm:
WATANABE Kaoru (KUNPU INTELLECTUAL PROPERTY AGENTS, SUCCESS-SENGAKUJI BLDG. 3F 2-20-29, Takanawa, Minato-k, Tokyo 74, 〒1080074, JP)
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