Title:
HIGH-FREQUENCY AMPLIFIER UNIT AND HIGH-FREQUENCY POWER AMPLIFICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2017/188354
Kind Code:
A1
Abstract:
The present invention is provided with a cooler (11) in which a first high-frequency amplifier (12) for amplifying and outputting high-frequency signals from an output terminal is installed in close contact with a first surface (11a), and a second high-frequency amplifier (13) for amplifying and outputting high-frequency signals from an output terminal is installed in close contact with a second surface (11b) on the opposite side of the first surface (11a). The cooler (11) has a first cooler terminal (11d), through which a refrigerant flows into the cooler (11), and a second cooler terminal (11e), through which the refrigerant flows out from the cooler (11), disposed on a third surface (11c) intersecting the first surface (11a) and the second surface (11b).
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Inventors:
NONOMURA HIROYUKI (JP)
Application Number:
PCT/JP2017/016653
Publication Date:
November 02, 2017
Filing Date:
April 27, 2017
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP (JP)
International Classes:
H03F3/68; H01L23/473; H03F3/21
Foreign References:
| JP2016025098A | 2016-02-08 | |||
| JP2014013884A | 2014-01-23 | |||
| JPS62265805A | 1987-11-18 | |||
| JPS5198044U | 1976-08-06 | |||
| JP2005109810A | 2005-04-21 |
Attorney, Agent or Firm:
MURAKAMI, Kanako et al. (JP)
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