Title:
HIGH-FREQUENCY CIRCUIT BOARD AND ELECTRONIC APPARATUS
Document Type and Number:
WIPO Patent Application WO/2021/112160
Kind Code:
A1
Abstract:
A high-frequency circuit board (10) is provided with: a base material (20) having flexibility and comprising an insulating material; a linear signal conductor (30) disposed in the base material (20) and extending in a first direction (DIR1); and a ground conductor (40) disposed in the base material (20) and having a surface opposing the signal conductor (30) along the first direction (DIR1). The signal conductor (30), the ground conductor (40), and the base material (20) together form a high-frequency signal transmission line. The transmission line includes a region (101) and a region (103) adjacent to each other in the first direction (DIR1). The region (101) is a non-bending region, and the region (103) is a bending region. In the region (101) and the region (103), the signal conductor (30) and the ground conductor (40) oppose each other across a certain distance. The ground conductor (40) in the region (103) includes recesses (443, 444) at positions not opposing the signal conductor (30) in which no conductor is formed.
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Inventors:
ICHIKAWA KEIICHI (JP)
HATSUDA IPPEI (JP)
ARAKI KEISUKE (JP)
HATSUDA IPPEI (JP)
ARAKI KEISUKE (JP)
Application Number:
PCT/JP2020/044967
Publication Date:
June 10, 2021
Filing Date:
December 03, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P1/02; H01P3/00; H01P3/08; H05K1/02
Foreign References:
| JP2000091801A | 2000-03-31 | |||
| JPS6146767A | 1986-03-07 | |||
| JP2014086655A | 2014-05-12 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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