Title:
HIGH FREQUENCY CIRCUIT COMPONENT
Document Type and Number:
WIPO Patent Application WO/2007/141997
Kind Code:
A1
Abstract:
A parasitic capacitance between a high frequency circuit element and a substrate
is reduced, and furthermore, mechanical strength is improved. The high frequency
circuit component is provided with a substrate (1) having conductivity; a coil
(2) as a high frequency circuit element; a mounting board (3) composed of a dielectric
thin film for mounting the coil (2); and a supporting board (4) for mechanically
connecting between the substrate (1) and the mounting board (3) and supporting
the mounting board (3) in a status where the mounting board is floated from the
substrate (1).
Inventors:
SUZUKI YOSHIHIKO (JP)
KONISHI HIROSHI (JP)
NISHIYAMA MADOKA (JP)
KONISHI HIROSHI (JP)
NISHIYAMA MADOKA (JP)
Application Number:
PCT/JP2007/059860
Publication Date:
December 13, 2007
Filing Date:
May 14, 2007
Export Citation:
Assignee:
NIKON CORP (JP)
SUZUKI YOSHIHIKO (JP)
KONISHI HIROSHI (JP)
NISHIYAMA MADOKA (JP)
SUZUKI YOSHIHIKO (JP)
KONISHI HIROSHI (JP)
NISHIYAMA MADOKA (JP)
International Classes:
H05K1/14; B81B3/00; H01F17/00; H01F17/02; H01F27/06
Foreign References:
| JP2004221285A | 2004-08-05 | |||
| JP2005251549A | 2005-09-15 |
Attorney, Agent or Firm:
THE PATENT CORPORATE BODY SHOWYOU INTERNATIONAL (9-10 Kitasaiwai 2-chome, Nishi-k, Yokohama-shi Kanagawa 04, JP)
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