Title:
HIGH-FREQUENCY CIRCUIT MODULE
Document Type and Number:
WIPO Patent Application WO/2015/056473
Kind Code:
A1
Abstract:
This high-frequency circuit module (100) is provided with: a stacked body (110); and a surface-mounted component (120) mounted to a surface of the stacked body (110). Variable capacitance elements (VC11, VC12, VC13) are integrated into the surface-mounted component (120). In the stacked body (110), conductor patterns are used to form inductors (SL11, SL12, SL13). In a rear surface of the stacked body (110), a first external connection terminal (PDRF1) and a second external connection terminal (PDRF2) are formed, and are disposed so as to be sandwiched between a plurality of ground connection terminals (PDG). A plurality of grounding via conductors (ViaG), which are connected to the plurality of ground connection terminals (PDG), extend to the surface of the stacked body (110). In a layer in the vicinity of the surface, the plurality of grounding via conductors (ViaG) are connected by a ground connection conductor (PCG) extending in a direction orthogonal to an extension direction of the grounding via conductors.
Inventors:
HARADA TETSURO (JP)
Application Number:
PCT/JP2014/069141
Publication Date:
April 23, 2015
Filing Date:
July 18, 2014
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H03H7/38; H03H7/075; H03H7/12; H05K3/46
Domestic Patent References:
| WO2013005264A1 | 2013-01-10 | |||
| WO2008004396A1 | 2008-01-10 |
Foreign References:
| JP2010219941A | 2010-09-30 |
Attorney, Agent or Firm:
Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
Patent business corporation Kaede Patent Attorneys' Office (JP)
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