Title:
HIGH-FREQUENCY CIRCUIT AND RADIO DEVICE
Document Type and Number:
WIPO Patent Application WO/2022/030238
Kind Code:
A1
Abstract:
A high-frequency circuit according to the present invention comprises: a first ground layer on which a conductor is formed; a second ground layer on which a conductor is formed; and a conductive pattern layer on which a first conductive pattern is formed. The first ground layer, the second ground layer, and the conductive pattern layer are laminated, and in the lamination direction of the first ground layer, the second ground layer, and the conductive pattern layer, the conductive pattern layer includes a first region in which a distance to the conductor formed on the second ground layer is longer than a distance to the conductor formed on the first ground layer. At least a portion of the first conductive pattern is provided in the first region.
Inventors:
MIYAGAWA YUTA (JP)
LI CHAORAN (JP)
LI CHAORAN (JP)
Application Number:
PCT/JP2021/026966
Publication Date:
February 10, 2022
Filing Date:
July 19, 2021
Export Citation:
Assignee:
SUMITOMO ELECTRIC INDUSTRIES (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
AUTONETWORKS TECHNOLOGIES LTD (JP)
SUMITOMO WIRING SYSTEMS (JP)
International Classes:
H01P1/203; H05K3/46
Foreign References:
| JP2002271109A | 2002-09-20 | |||
| JP2003110311A | 2003-04-11 | |||
| JP2001044712A | 2001-02-16 | |||
| JP2006262396A | 2006-09-28 |
Attorney, Agent or Firm:
ONEDEE IP PARTNERS (JP)
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