Title:
HIGH-FREQUENCY CIRCUIT SUBSTRATE
Document Type and Number:
WIPO Patent Application WO/2014/106930
Kind Code:
A1
Abstract:
Provided is a high-frequency circuit substrate with which electric signal transmission loss under high frequency is reduced, adhesiveness between a copper foil and a resin layer is increased, solder reflow resistance is excellent, and the dielectric constant and dielectric dissipation factor are low. This high-frequency circuit substrate of the present invention is obtained by laminating, in this order, (A) a copper foil, (B) a polyimide layer, (C) a fluorine resin layer, (D) a polyimide layer, and (E) a copper foil. The polyimide resin that forms the polyimide layer is obtained by imidation of polyamic acid obtained by reacting (a) a diamine represented by formula (1) (where n is 0 or 1), (b) an aromatic diamine such as 4,4'-diaminodiphenylpropane, and (c) an aromatic tetrabasic acid dianhydride.
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Inventors:
AKATSUKA YASUMASA (JP)
MOTEKI SHIGERU (JP)
UCHIDA MAKOTO (JP)
KOUMOTO TAIHEI (JP)
TSUJI MAKOTO (JP)
MOTEKI SHIGERU (JP)
UCHIDA MAKOTO (JP)
KOUMOTO TAIHEI (JP)
TSUJI MAKOTO (JP)
Application Number:
PCT/JP2013/084122
Publication Date:
July 10, 2014
Filing Date:
December 19, 2013
Export Citation:
Assignee:
NIPPON KAYAKU KK (JP)
International Classes:
H05K1/03; B32B15/08; B32B15/088; C08G73/10
Foreign References:
JP2011051203A | 2011-03-17 | |||
JP2005146074A | 2005-06-09 |
Attorney, Agent or Firm:
SHOBAYASHI, Masayuki (JP)
Right wood Masayuki (JP)
Right wood Masayuki (JP)
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