Title:
HIGH-FREQUENCY CIRCUIT
Document Type and Number:
WIPO Patent Application WO/2023/126994
Kind Code:
A1
Abstract:
This high-frequency circuit is provided with a substrate, a first amplifier, a post wall waveguide, and a cover member. The first amplifier is mounted on the substrate and amplifies a high-frequency signal. The post wall waveguide is formed within the substrate and transmits a high-frequency signal that has been amplified or is to be amplified by the first amplifier. The cover member is conductive and covers an area which is a part of the substrate, and includes at least the first amplifier.
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Inventors:
KISHIDA TAKEHIRO (JP)
YAMAMOTO ATSUHIRO (JP)
SAKAI TOSHIFUMI (JP)
YAMAMOTO ATSUHIRO (JP)
SAKAI TOSHIFUMI (JP)
Application Number:
PCT/JP2021/048465
Publication Date:
July 06, 2023
Filing Date:
December 27, 2021
Export Citation:
Assignee:
FURUNO ELECTRIC CO (JP)
International Classes:
H01P3/12; H03F3/60; H03F3/68
Foreign References:
JPH05206710A | 1993-08-13 | |||
JP2015076836A | 2015-04-20 | |||
JP2010103982A | 2010-05-06 | |||
JP2012100020A | 2012-05-24 | |||
JP2015128276A | 2015-07-09 | |||
JPH08195632A | 1996-07-30 |
Attorney, Agent or Firm:
KAEDE PATENT ATTORNEYS' OFFICE (JP)
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