Title:
HIGH FREQUENCY COUPLER
Document Type and Number:
WIPO Patent Application WO/2011/111578
Kind Code:
A1
Abstract:
Disclosed is a downsized, thinner high frequency coupler which is used for communicating high frequency signals, and is resistant to lateral sliding. The coupler is provided with a circuit board, and an antenna element formed on either the surface or the inner surface of the circuit board, wherein the antenna element is defined by alternately repeated first paths extending from the inside to the outside of a circle formed on the surface and second paths extending from the outside to the inside of the circle, so as to have a shape looping along the circle.
Inventors:
USUI HIDEYUKI (JP)
DOBASHI DAISUKE (JP)
DOBASHI DAISUKE (JP)
Application Number:
PCT/JP2011/054735
Publication Date:
September 15, 2011
Filing Date:
March 02, 2011
Export Citation:
Assignee:
TYCO ELECTRONICS JAPAN G K (JP)
USUI HIDEYUKI (JP)
DOBASHI DAISUKE (JP)
USUI HIDEYUKI (JP)
DOBASHI DAISUKE (JP)
International Classes:
H01Q7/00; G06K19/07; G06K19/077; H01Q1/38; H01Q21/06; H04B5/02
Foreign References:
| JP2006235824A | 2006-09-07 | |||
| JP2007188252A | 2007-07-26 |
Attorney, Agent or Firm:
YAMADA, Masaki et al. (JP)
Masanori Yamada (JP)
Masanori Yamada (JP)
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Claims:
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