HIGH FREQUENCY DEVICE MODULE AND METHOD FOR MANUFACTURING THE SAME

Title:

HIGH FREQUENCY DEVICE MODULE AND METHOD FOR MANUFACTURING THE SAME

Document Type and Number:

WIPO Patent Application WO/2007/132560

Kind Code:

A1

Abstract:

Disclosed is a high frequency device module comprising an insulating substrate, which is provided with an electrode on the front side while being provided with a ground substrate on the back side, a high frequency device formed on the insulating substrate and connected with the electrode at a terminal, a potting material covering the high frequency device, and a metal layer formed on the potting material and connected with the ground substrate.

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Inventors:

YOSHIDA, Tomohiro (C/O INTELLECTUAL PROPERTY DIVISION, TOSHIBA CORPORATION 1-1, Shibaura 1-chome, Minato-k, Tokyo 01, 1058001, JP)

Application Number:

JP2007/000509

Publication Date:

November 22, 2007

Filing Date:

May 11, 2007

Export Citation:

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Assignee:

KABUSHIKI KAISHA TOSHIBA (1-1 Shibaura 1-chome, Minato-ku Tokyo, 01, 1058001, JP)
株式会社東芝 (〒01 東京都港区芝浦一丁目１番１号 Tokyo, 1058001, JP)

International Classes:

H01L23/00; H01L23/28; H05K9/00

Attorney, Agent or Firm:

AMAGI INTERNATIONAL PATENT LAW OFFICE (SOLID SQUARE EAST TOWER 4F, 580 Horikawa-cho, Saiwai-k, Kawasaki-shi Kanagawa 13, 2120013, JP)

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