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Title:
HIGH-FREQUENCY DIELECTRIC HEATING ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2023/054114
Kind Code:
A1
Abstract:
A high-frequency dielectric heating adhesive (1A) contains a thermoplastic resin (A) and a cyano group-containing organic compound (B), and satisfies the following (1). (1) The total light transmittance of the high-frequency dielectric heating adhesive (1A) as measured according to JIS K 7361-1:1997 is at least 50%.

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Inventors:
MORI YUICHI (JP)
TAYA NAOKI (JP)
Application Number:
PCT/JP2022/035162
Publication Date:
April 06, 2023
Filing Date:
September 21, 2022
Export Citation:
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Assignee:
LINTEC CORP (JP)
International Classes:
C09J11/06; C09J7/30; C09J11/08; C09J201/00
Domestic Patent References:
WO2018079356A12018-05-03
Foreign References:
JP2020070365A2020-05-07
JP2019073663A2019-05-16
JP2018177825A2018-11-15
JPH1060385A1998-03-03
JPH0776685A1995-03-20
JPH0514044A1993-01-22
JPH04296381A1992-10-20
JP2008156510A2008-07-10
JP2014037489A2014-02-27
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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