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Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/091954
Kind Code:
A1
Abstract:
The present invention increases the element value of a circuit element included in an electronic component. In a high-frequency module (100), a conductive layer (6) covers a major surface (51) of a resin layer (5) on a side opposite the side of a mounting substrate (9), and a major surface (11) of an electronic component (1) on a side opposite the side of the mounting substrate (9). The electronic component (1) includes an electronic component body (2) and a plurality of external electrodes (3). The electronic component body (2) comprises an electrical insulator portion (21), and a conductor (14) provided in the electrical insulator portion (21) and constituting at least a part of a circuit element (15) of the electronic component (1). The electronic component body (2) includes a third major surface (23) and a fourth major surface (24) opposing each other, and an outer peripheral surface (25). The third major surface (23) constitutes the major surface (11) of the electronic component (1) and is in contact with the conductive layer (6). Each of the plurality of external electrodes (3) is provided on the fourth major surface (24) of the electronic component body (2) and does not reach the third major surface (23).

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Inventors:
UEJIMA TAKANORI
NAKAGAWA DAI
YAMAGUCHI YUKIYA
TAKEMATSU YUJI
TSUDA MOTOJI
ONO MAYUKA
FUJIWARA HIROKI
AIKAWA KIYOSHI
YAMADA TAKASHI
Application Number:
PCT/JP2021/039035
Publication Date:
May 05, 2022
Filing Date:
October 22, 2021
Export Citation:
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Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/38; H01F17/00; H01F27/00; H01G4/30; H01G4/40; H01L25/04; H01L25/18; H03H7/01; H03H7/46; H03H9/25; H03H9/72
Domestic Patent References:
WO2006046713A12006-05-04
WO2007114224A12007-10-11
WO2018159453A12018-09-07
Foreign References:
KR20150000173A2015-01-02
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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