Title:
HIGH FREQUENCY MODULE AND COMMUNICATION APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/145412
Kind Code:
A1
Abstract:
The present invention decreases the size of a high frequency module. A high frequency module (200) is provided with a mounting substrate (9), a first electronic component (1), a second electronic component (2), and a third electronic component (3). The first electronic component (1) includes a first transmission filter (51) and a second transmission filter (52). The first electronic component (1) has a substrate common to the first transmission filter (51) and the second transmission filter (52). The second electronic component (2) includes a third transmission filter (53). The third electronic component (3) includes a first reception filter (61), a second reception filter (62), and a third reception filter (63). The third electronic component (3) has a substrate common to the first reception filter (61), the second reception filter (62), and the third reception filter (63).
Inventors:
TAKEBE MASAHIDE
KUROYANAGI TAKUMA
KUROYANAGI TAKUMA
Application Number:
PCT/JP2021/048495
Publication Date:
July 07, 2022
Filing Date:
December 27, 2021
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01P5/08; H01L23/00; H01L25/04; H01L25/18; H03H9/17; H03H9/25; H03H9/54; H03H9/64; H03H9/70; H03H9/72; H04B1/00; H04B1/38
Domestic Patent References:
| WO2010087307A1 | 2010-08-05 | |||
| WO2020054388A1 | 2020-03-19 | |||
| WO2019188875A1 | 2019-10-03 | |||
| WO2019167908A1 | 2019-09-06 |
Foreign References:
| JP2018113717A | 2018-07-19 | |||
| JP2010010765A | 2010-01-14 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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