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Patent Searching and Data


Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/102869
Kind Code:
A1
Abstract:
A high-frequency module (1) is provided with a multilayer dielectric substrate (2), an RFIC (21), and an array antenna (13). The array antenna (13) comprises a plurality of first patch antennas (11) having the same polarization direction as one another, and a plurality of second patch antennas (12) having the same polarization direction as one another, said polarization direction being located between two orthogonal polarized waves of the first patch antennas (11). The first patch antennas (11) and the second patch antennas (12) each operate simultaneously as transmitting antennas or receiving antennas.

Inventors:
UEDA Hideki (10-1, Higashikotari 1-chome, Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
Application Number:
JP2018/041649
Publication Date:
May 31, 2019
Filing Date:
November 09, 2018
Export Citation:
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Assignee:
MURATA MANUFACTURING CO., LTD. (10-1, Higashikotari 1-chome Nagaokakyo-sh, Kyoto 55, 〒6178555, JP)
International Classes:
H01Q21/06; H01Q13/08; H01Q23/00
Domestic Patent References:
WO2017047199A12017-03-23
Foreign References:
JP2017508402A2017-03-23
JP2011527151A2011-10-20
JP2004088199A2004-03-18
Attorney, Agent or Firm:
HIROWA PATENT FIRM (4F. Nishishinjuku Koide Bldg, 1-3 Nishishinjuku 3-chome, Shinjuku-k, Tokyo 23, 〒1600023, JP)
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