Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/167416
Kind Code:
A1
Abstract:
The purpose of the present invention is to achieve both reduction in the number of circuits and improvement in current efficiencies of transmission circuits. The high-frequency module (1) is provided with a first package (3) and a second package (4). A first transmission circuit (51) of the first package (3) transmits a first transmit signal of a first transmit band based on a first communication standard, and a first reception circuit (52) thereof receives a first receive signal of a first receive band based on the first communication standard. A second transmission circuit (61) of the second package (4) transmits a second transmit signal of a second transmit band based on a second communication standard, and a second reception circuit (62) thereof receives a second receive signal of a second receive band based on the second communication standard. A third reception circuit (72) of the first package (3) receives a third receive signal of a third receive band based on a third communication standard. At least a portion of the third receive band overlaps with the first receive band. A third transmission circuit (71) of the second package (4) transmits a third transmit signal of a third transmit band based on the third communication standard.
Inventors:
TAKADA ATSUSHI
Application Number:
PCT/JP2018/047996
Publication Date:
September 06, 2019
Filing Date:
December 27, 2018
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/40; H04B1/00
Domestic Patent References:
| WO2006112306A1 | 2006-10-26 |
Foreign References:
| JP2014505449A | 2014-02-27 | |||
| JP2006129419A | 2006-05-18 | |||
| US20130172056A1 | 2013-07-04 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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