Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/240097
Kind Code:
A1
Abstract:
This high-frequency module (1A) comprises: a reception low-noise amplifier (21) which amplifies a high-frequency reception signal in communication band A; a reception low-noise amplifier (22) which amplifies a high-frequency reception signal in communication band C; and a module board (91) which has principal surfaces (91a and 91b) which face one another and upon which is mounted the reception low-noise amplifier (21) and the reception low-noise amplifier (22). The reception low-noise amplifier (21) is positioned on one principal surface (91a) and the reception low-noise amplifier (22) is positioned on the other principal surface (91b).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2019/022987
Publication Date:
December 19, 2019
Filing Date:
June 10, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H03H7/46; H03H9/70; H03H9/72; H04B1/50
Domestic Patent References:
WO2008075691A1 | 2008-06-26 |
Foreign References:
US20150366099A1 | 2015-12-17 | |||
JP2012070267A | 2012-04-05 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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