Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/244815
Kind Code:
A1
Abstract:
A high-frequency module (1) is provided with: a transmission power amplifier (11) which comprises a plurality of amplification elements connected in multiple stages; and a module substrate (91) which has principal surfaces (91a and 91b) facing each other, and on which the transmission power amplifier (11) is mounted. The plurality of amplification elements include an amplification element (11B) disposed at the last stage of the plurality of amplification elements, and an amplification element (11A) disposed at a stage prior to the amplification element (11B), the amplification element (11B) is mounted on the principal surface (91a), and the amplification element (11A) is mounted on the principal surface (91b).
Inventors:
UEJIMA TAKANORI (JP)
Application Number:
PCT/JP2019/023804
Publication Date:
December 26, 2019
Filing Date:
June 17, 2019
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H04B1/00; H04B1/38
Domestic Patent References:
| WO2018043162A1 | 2018-03-08 | |||
| WO2007083668A1 | 2007-07-26 |
Foreign References:
| JP2013059033A | 2013-03-28 | |||
| JP2014042094A | 2014-03-06 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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