HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE

WIPO Patent Application WO/2020/090230

A1

A high-frequency module (1A) is provided with: a module substrate (70B) having main surfaces (701 and 702); a module substrate (70A) having main surfaces (703 and 704) with the main surface (703) facing the main surface (702); a transmission filter (12) having a mounting surface (122) and a top surface (121), the mounting surface (122) being disposed facing the main surface (702); and a reception filter (22) having a mounting surface (222) and a top surface (221), the mounting surface (222) being disposed facing the main surface (703). When the substrates are viewed in plan, the transmission filter (12) and the reception filter (22) partly overlap each other. The transmission filter (12) has an output terminal (12c) disposed on the top surface (121), and the reception filter (22) has an input terminal (22a) disposed on the top surface (221), wherein the output terminal (12c) and the input terminal (22a) are connected by means of connecting electrodes (81b and 82b) that do not pass through the module substrates (70A and 70B).

JP4664213	Antenna device
JP3642261	RADIO TERMINAL

TAKEMATSU YUJI (JP)
UEJIMA TAKANORI (JP)
MATSUMOTO SHO (JP)
HARADA TETSURO (JP)
NAKAGAWA DAI (JP)
MATSUMOTO NAOYA (JP)
SASAKI YUTAKA (JP)
FUKUDA YUUKI (JP)

PCT/JP2019/035132

May 07, 2020

September 06, 2019

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MURATA MANUFACTURING CO (JP)

H04B1/38; H03H7/46; H03H9/70; H03H9/72

WO2017033564A1	2017-03-02
WO2018123699A1	2018-07-05

JPH0685506A

1994-03-25

YOSHIKAWA, Shuichi et al. (JP)

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