Title:
HIGH-FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2020/179504
Kind Code:
A1
Abstract:
A high-frequency module (1) is provided with: a mounting substrate (91) having a ground electrode layer (915) formed of a planar wire pattern; a plurality of ground terminals (93) which are a plurality of external connection terminals arranged on a main surface (91b) of the mounting substrate (91) and set to a ground potential; and a first high-frequency component (for example, a reception filter (62) and/or a low-noise amplifier (22)) mounted on the main surface (91b). The plurality of ground terminals (93) are arranged closer to the outer peripheral side of the main surface (91b) than the first high-frequency component, and are connected to a ground electrode layer (915). In a plan view of the mounting substrate (91), at least part of the first high-frequency component overlaps the ground electrode layer (915).
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Inventors:
YAMAGUCHI YUKIYA (JP)
Application Number:
PCT/JP2020/007094
Publication Date:
September 10, 2020
Filing Date:
February 21, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L23/00; H01L23/02; H01L25/04; H01L25/18; H04B1/38
Domestic Patent References:
| WO2018168653A1 | 2018-09-20 |
Foreign References:
| JP2004071961A | 2004-03-04 |
Attorney, Agent or Firm:
YOSHIKAWA, Shuichi et al. (JP)
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