Title:
HIGH FREQUENCY MODULE AND COMMUNICATION DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/002296
Kind Code:
A1
Abstract:
The present invention achieves a reduction in the dimension of a mounting board in the thickness direction. This high frequency module (1) comprises a mounting board (9), an electronic component (2), a first chip component (3A), and a second chip component (3B). The electronic component (2) is mounted on a first main surface (91) of the mounting board (9). The first chip component (3A) and the second chip component (3B) are mounted on a second main surface (92) of the mounting board (9). Each of the first chip component (3A) and the second chip component (3B) includes a substrate (31) and a circuit unit (32). The substrate (31) has a first main surface (311) and a second main surface (312) facing each other. The circuit unit (32) is formed on the first main surface (311) side of the substrate (31). The second main surface (312) of the substrate (31) in each of the first chip component (3A) and the second chip component (3B) is exposed. The material of the substrate (31) in the first chip component (3A) is the same as the material of the substrate (31) in the second chip component (3B).
Inventors:
KITAJIMA HIROMICHI
Application Number:
PCT/JP2020/025316
Publication Date:
January 07, 2021
Filing Date:
June 26, 2020
Export Citation:
Assignee:
MURATA MANUFACTURING CO (JP)
International Classes:
H01L25/04; H04B1/38; H05K1/18
Domestic Patent References:
| WO2019054154A1 | 2019-03-21 | |||
| WO2018003268A1 | 2018-01-04 |
Foreign References:
| JP2016167577A | 2016-09-15 |
Attorney, Agent or Firm:
HOKUTO PATENT ATTORNEYS OFFICE (JP)
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